An apparatus, system, and method for cooling a lamp assembly is described herein. The apparatus includes an air channel and an axial slot. A flow of air is injected into the air channel of a lamp housing, wherein the lamp housing comprises at least a bulb. The axial slot is located in a reflector housing and has dimensions that enable a constant flow of air through the slot and across the bulb when a predetermined air flow is input to the air channel.

An apparatus, system, and method for cooling a lamp assembly is described herein. The apparatus includes an air channel and an axial slot. A flow of air is injected into the air channel of a lamp housing, wherein the lamp housing comprises at least a bulb. The axial slot is located in a reflector housing and has dimensions that enable a constant flow of air through the slot and across the bulb when a predetermined air flow is input to the air channel.

An infrared emitter is formed having a reduced thermal mass and increased thermal conductivity to effectively deliver and dissipate heat from a heating element that emits electromagnetic radiation. The improved thermal dynamic process may enhance one or both of power consumption and/or longevity.

An infrared emitter is formed having a reduced thermal mass and increased thermal conductivity to effectively deliver and dissipate heat from a heating element that emits electromagnetic radiation. The improved thermal dynamic process may enhance one or both of power consumption and/or longevity.

A conductive structure comprising: a plurality of conductive devices; a first conductive spring sheet, comprising a first connecting point; and a second conductive spring sheet, comprising a second connecting point. Each of the conductive devices comprises a first conductive end and a second conductive end. The second conductive end is connected to the second connecting point, and the first conductive end is connected to the first connecting point corresponding to the second connecting point to which the second conductive end is connected.

A conductive structure comprising: a plurality of conductive devices; a first conductive spring sheet, comprising a first connecting point; and a second conductive spring sheet, comprising a second connecting point. Each of the conductive devices comprises a first conductive end and a second conductive end. The second conductive end is connected to the second connecting point, and the first conductive end is connected to the first connecting point corresponding to the second connecting point to which the second conductive end is connected.

An apparatus, system, and method for cooling a lamp assembly is described herein. The apparatus includes an air channel and an axial slot. A flow of air is injected into the air channel of a lamp housing, wherein the lamp housing comprises at least a bulb. The axial slot is located in a reflector housing and has dimensions that enable a constant flow of air through the slot and across the bulb when a predetermined air flow is input to the air channel.

An apparatus, system, and method for cooling a lamp assembly is described herein. The apparatus includes an air channel and an axial slot. A flow of air is injected into the air channel of a lamp housing, wherein the lamp housing comprises at least a bulb. The axial slot is located in a reflector housing and has dimensions that enable a constant flow of air through the slot and across the bulb when a predetermined air flow is input to the air channel.

Methods and apparatus disclosed herein generally relate to lamp heating of process chambers used to process semiconductor substrates. More specifically, implementations disclosed herein relate to arrangement and control of lamps for heating of semiconductor substrates. In some implementations of the present disclosure, fine-tuning of temperature control is achieved by dividing different lamps within an array of lamps into various subgroups or lamp assemblies defined by a specific characteristic. These various subgroups may be based on characteristics such as lamp design and/or lamp positioning within the processing chamber.

Methods and apparatus disclosed herein generally relate to lamp heating of process chambers used to process semiconductor substrates. More specifically, implementations disclosed herein relate to arrangement and control of lamps for heating of semiconductor substrates. In some implementations of the present disclosure, fine-tuning of temperature control is achieved by dividing different lamps within an array of lamps into various subgroups or lamp assemblies defined by a specific characteristic. These various subgroups may be based on characteristics such as lamp design and/or lamp positioning within the processing chamber.