The present description concerns a ROM including at least one first rewritable memory cell.

Integrated circuit package (ICP) with: (i) stored information pertaining to an amount and/or value of precious material present in the ICP; and (ii) sensor for detecting an amount of precious material present in the ICP. In some embodiments the ICP is embedded in a smart card for use with a smart card reader system that can communicate data to and/or from the ICP.

An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.

A method for producing an individualisation area includes providing at least a first level of the electrical tracks. The method includes depositing a dielectric layer and a deformable layer on the interconnection level. The method includes producing, in an area of the deformable layer, recessed patterns, by penetrating an imprint mould into the deformable layer, the production of the patterns being configured so that the patterns have a randomness in the deformable layer, thus forming random patterns. The method includes transferring the random patterns into the dielectric layer to form transferred random patterns therein and exposing the vias located in line with the transferred random patterns. The method includes filling the transferred random patterns with an electrically conductive material so as to form electrical connections between vias. The method includes producing a second level of the electrical tracks on the vias and the electrical connections.

A physical unclonable function (PUF) chip is provided. The physical unclonable function (PUF) chip includes a chip with a top metal connection layer, an array of spaced electrode plates on the top metal connection layer of the chip, a deposition layer, on the top metal connection layer between each two adjacent electrode plates. An opening is formed between the each two adjacent electrode plates in a row, and each two adjacent electrode plates are tangential to the opening formed between the two adjacent electrode plates. The physical unclonable function (PUF) chip further includes a conductive coating layer on the chip and the conductive coating layer includes conductive particles with randomly distributed size, and a package substrate, packaged with the chip including the conductive coating layer.

A method for producing a PUF-film includes printing a layer of dielectric material on a film substrate, such that a variable thickness of the layer is obtained by the printing. The method includes arranging a structured electrode layer on the dielectric material such that the structured electrode layer is influenced with respect to an electric measurement value due to the variable thickness.

The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.

The present exemplary embodiments provide a security circuit which senses a micro probe attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal reflected by the connected wire path, or senses a focused ion beam attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal which passes through a selected wire for every group, or blocks a physical approach by changing an accessible signal path to be a high impedance state when an external attack is detected by the detection circuit.

A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.

Integrated circuit package (ICP) with: (i) stored information pertaining to an amount and/or value of precious material present in the ICP; and (ii) sensor for detecting an amount of precious material present in the ICP. In some embodiments the ICP is embedded in a smart card for use with a smart card reader system that can communicate data to and/or from the ICP.