Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

In an embodiment, a wafer bonding system includes a chamber, a gas inlet and a gas outlet configured to control a pressure of the chamber to be in a range from 1×10.sup.−2 mbar to 1520 torr, a first wafer chuck having a first surface to support a first wafer, and a second wafer chuck having a second surface to support a second wafer, the second surface being opposite the first surface, the second wafer chuck and the first wafer chuck being movable relative to each other, wherein the second surface that supports the second wafer is divided into zones, wherein a vacuum pressure of each zone is controlled independently of other zones.

Bonding tools and related systems are provided for surface cleaning and direct bonding. A bonding tool includes a support configured to hold a first element, and is further configured to bond a second element to the first element by way of direct bonding. A laser cleaning assembly is configured to clean the first and/or second element prior to bonding, and can be integrated with the bonding tool. The laser cleaning can also clean surfaces of the bonding tool and/or a robotic end effector for delivering the second element. Methods and sequences for surface cleaning and direct bonding using the systems are also disclosed.

A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.

A package device manufacturing method is provided. In the manufacturing method, device chips are disposed on first regions of a workpiece, and a mold resin is supplied to second regions higher than the first regions and the first regions. Further, the mold resin is processed and thinned to a thickness with which the second regions of the workpiece are not exposed, and the mold resin is polished to expose the second regions of the workpiece and form, in the workpiece, a flat surface including the mold resin and the second regions, the mold resin being disposed on the first regions. Moreover, the workpiece is divided to manufacture the individual package devices.

A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

The invention relates to a device and a method for the alignment of substrates.

A system for direct bonding can include a substrate support configured to hold a substrate for direct bonding and a die handling tool including an end effector configured to hold a die and bring the die into contact with the substrate supported on the substrate support, the end effector configured to initiate contact between the substrate and a bond initiation region of the die and to subsequently allow contact between the substrate and other regions of the die.

In one embodiment, a semiconductor manufacturing apparatus includes a magnification difference acquirer configured to acquire a value of difference in magnification between a first substrate and a second substrate. The apparatus further includes a deformation amount determiner configured to determine a value of deformation amount of a chuck that holds the first or second substrate, based on the value of the difference in magnification. The apparatus further includes a gap determiner configured to determine a value of a gap between the first substrate and the second substrate, based on the value of the deformation amount. The apparatus further includes a bonding controller configured to control the deformation amount to the determined value and control the gap to the determined value, before the first substrate and the second substrate are bonded together.