A solar power generator includes a support, a plurality of first electrodes disposed on one side of the support, a solar cell module mounted to the support, and a plurality of second electrodes disposed on the opposite side of the support. The solar cell module is electrically connected to a pair of the first electrodes via a transmission line for module connection. Three pairs of the second electrodes are electrically connected one-to-one to three pairs of the first electrodes via a transmission line for passage of current. Three of the second electrodes are electrically connected to one of the first electrode via the transmission line for passage of current.

A multijunction solar cell including an upper first solar subcell having a first band gap and positioned for receiving an incoming light beam; a second solar subcell disposed below and adjacent to and lattice matched with said upper first solar subcell, and having a second band gap smaller than said first band gap; wherein the upper first solar subcell covers less than the entire upper surface of the second solar subcell, leaving an exposed portion of the second solar subcell that lies in the path of the incoming light beam.

A solar cell panel includes a plurality of solar cells including first and second solar cells, and a plurality of wiring members electrically connecting the first and second solar cells. A first electrode of each of the first and second solar cells includes a first bus bar including a plurality of first pad portions. The plurality of first pad portions include a first end pad positioned on one end side of the first bus bar and on which an end of the wiring member is positioned, and a first extension pad positioned on the other end side of the first bus bar and on an extension of the wiring member. An area of the first end pad is different from an area of the first extension pad.

Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

A method of forming a sandwich passivation layer (405) on a semiconductor device (400) comprising a bond pad (404) is provided. The method comprises forming a first layer (406) over a surface of the semiconductor device (400), removing a part of the first layer (406) to expose a surface of the bond pad (404), forming a second layer (407) over the first layer (406) and the surface of the bond pad (404), and forming a third layer (408) over the second layer (407), wherein the surface of the bond pad (404) is not in contact with the first layer (406) or third layer (408).

A semiconductor light-emitting device includes a GaAs (gallium arsenide) substrate of a cubic crystal, a light-emitting layer and a multi-semiconductor layer. The light-emitting layer being provided on the GaAs substrate. The light-emitting layer includes InGaAs (indium gallium arsenide) represented by a compositional formula InxGa1-xAs (0<x<1). The multi-semiconductor layer being provided on a front surface of the GaAs substrate between the GaAs substrate and the light-emitting layer. The multi-semiconductor layer is tilted with respect to a (100) plane of the cubic crystal. The multi-semiconductor layer includes a first layer and a second layer. The first and second layers are alternately stacked in a direction perpendicular to the front surface of the GaAs substrate. The first layer is different in composition from the second layer.

An integrated device comprising at least one photovoltaic element, at least one light modulating element, at least one light reflecting element and one or more electrical conductors coupled to the photovoltaic element and the light modulating element. An interrogating light beam can be pointed at the integrated device, and a modulated light beam is reflected back by the device in the direction of the interrogating light beam with the reflected light beam containing information/data being modulated by the device onto the reflected light beam.

There is provided a photodetection circuit capable of improving distance measuring performance.

The photodetection circuit according to an embodiment of the present disclosure includes: an avalanche photodiode; a charging circuit that supplies a voltage to the avalanche photodiode; an input amplifier including a comparison circuit in which a voltage level of an output terminal changes according to a comparison result between a voltage of an input terminal connected to the avalanche photodiode and a reference voltage, and a voltage control circuit that changes a potential of the reference voltage; and a state detecting circuit that sets timing for causing the voltage control circuit to change the potential of the reference voltage on the basis of a detection result of the voltage level.

An optical sensor includes a semiconductor substrate having a first conductive type. The optical sensor further includes a photodiode disposed on the semiconductor substrate and a metal layer. The photodiode includes a first semiconductor layer having the first conductive type and a second semiconductor layer, formed on the first semiconductor layer, including a plurality of cathodes having a second conductive type. The first semiconductor layer is configured to collect photocurrent upon reception of incident light. The cathodes are configured to be electrically connected to the first semiconductor layer and the second semiconductor layer is configured to, based on the collected photocurrent, to track the incident light. The metal layer further includes a pinhole configured to collimate the incident light, and the plurality of cathodes form a rotational symmetry of order n with respect to an axis of the pinhole.

A tandem solar cell according to an embodiment includes a top cell string, a bottom cell string, a top cell module, a first string connection, a bottom cell module, and a second string connection. The top cell string is formed by electrically connecting a plurality of top cells. The bottom cell string is formed by electrically connecting a plurality of bottom cells. The bottom cell string is arranged so as to overlap the top cell string in a plan view in a thickness direction of the top cell. The first string connection includes a first extending portion extending to an outside of the top cell module in the plan view. A plurality of bottom cell strings are electrically connected to the bottom cell module. The first extending portion and the second extending portion are arranged apart from each other in the plan view.