A display may include a color filter layer, a liquid crystal layer, and a thin-film transistor layer. A camera window may be formed in the display to accommodate a camera. The camera window may be formed by creating a notch in the thin-film transistor layer that extends inwardly from the edge of the thin-film transistor layer. The notch may be formed by scribing the thin-film transistor layer around the notch location and breaking away a portion of the thin-film transistor layer. A camera window may also be formed by grinding a hole in the display. The hole may penetrate partway into the thin-film transistor layer, may penetrate through the transistor layer but not into the color filter layer, or may pass through the thin-film transistor layer and partly into the color filter layer.

A display may include a color filter layer, a liquid crystal layer, and a thin-film transistor layer. A camera window may be formed in the display to accommodate a camera. The camera window may be formed by creating a notch in the thin-film transistor layer that extends inwardly from the edge of the thin-film transistor layer. The notch may be formed by scribing the thin-film transistor layer around the notch location and breaking away a portion of the thin-film transistor layer. A camera window may also be formed by grinding a hole in the display. The hole may penetrate partway into the thin-film transistor layer, may penetrate through the transistor layer but not into the color filter layer, or may pass through the thin-film transistor layer and partly into the color filter layer.

An optical sensor device includes an optical sensor and a mounting board. The optical sensor includes a substrate, a light receiver, a light emitter, and a transparent substrate. The substrate has a first recess and a second recess at a distance from the first recess. The light receiver is located in the first recess. The light emitter is located in the second recess and at a distance from the light receiver. The transparent substrate is located on a first upper surface of the substrate, bonded to the substrate, and covers the first recess and the second recess. The optical sensor is mounted with a first lower surface being oblique to a second lower surface of the mounting board.

An optical sensor device includes an optical sensor and a mounting board. The optical sensor includes a substrate, a light receiver, a light emitter, and a transparent substrate. The substrate has a first recess and a second recess at a distance from the first recess. The light receiver is located in the first recess. The light emitter is located in the second recess and at a distance from the light receiver. The transparent substrate is located on a first upper surface of the substrate, bonded to the substrate, and covers the first recess and the second recess. The optical sensor is mounted with a first lower surface being oblique to a second lower surface of the mounting board.

An optical transformer includes a plurality of light emitters, a plurality of photovoltaic cells positioned to receive light from at least a first subset of the plurality of light emitters, the plurality of photovoltaic cells including at least a first photovoltaic cell and a second photovoltaic cell, and one or more optically triggered switches positioned to receive light from at least a second subset of the plurality of light emitters, the one or more optically triggered switches including at least a first optically triggered switch electrically coupled to the first photovoltaic cell and the second photovoltaic cell. A method of operating the optical transformer is also described.

A fingerprint sensor includes four transistors and a photodetector. The first transistor connects a second node with a third node based on a voltage of a first node, where the first node corresponding to a first electrode of the photodetector. The second transistor connects the second node with a read-out line based on a scan signal. The third transistor supplies a reset voltage to the first node based on a first reset signal. The fourth transistor connects the first node with the second node based on a second reset signal.

A fingerprint sensor includes four transistors and a photodetector. The first transistor connects a second node with a third node based on a voltage of a first node, where the first node corresponding to a first electrode of the photodetector. The second transistor connects the second node with a read-out line based on a scan signal. The third transistor supplies a reset voltage to the first node based on a first reset signal. The fourth transistor connects the first node with the second node based on a second reset signal.

This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.

An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.

An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.