A semiconductor device is provided, which has a wide-bandgap semiconductor element, such as a SiC element, and which includes a sensor capable of responding sufficiently to characteristic requirements for protecting and controlling the semiconductor element. The semiconductor device includes a wide-bandgap semiconductor element mounted on a substrate; and a light-receiving element that receives light emitted from the wide-bandgap semiconductor element when the wide-bandgap semiconductor element is in a conduction state.

An biological body information acquisition apparatus includes an imager including light emitting devices that are arranged in a plane and emit light toward a human body and light receiving devices that are arranged in a plane and receive light from the human body and a light guide plate that is layered on the imager on the side thereof facing the human body and has light transmissivity in the direction of a normal to the light receiving devices and the light emitting devices. The light guide has a first portion (holes) and a second portion (substrate) that are arranged in a plane and have refractive indices different from each other. The first portion (holes) is so disposed as to coincide with the light receiving devices in a plan view, and the second portion (substrate) is so disposed as to coincide with the light emitting devices in the plan view.

A cover for a light source for use in a lamp or luminaire. An outer surface of the cover, opposite the light source, comprises a rounded shape and includes a protrusion extending from the cover. The protrusion extends substantially in a light emission direction and is shaped the protrusion to direct light emitted from the light source in a desired direction.

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.

There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.

A light detection devices includes a SPAD bias control block that adjusts a reverse bias voltage in accordance with a pulse number of a pulse signal which is output by a SPAD array upon incidence of first light.

A light detection devices includes a SPAD bias control block that adjusts a reverse bias voltage in accordance with a pulse number of a pulse signal which is output by a SPAD array upon incidence of first light.

According to one general aspect, an apparatus may include a memory circuit die configured to store a lookup table that converts first data to second data. The apparatus may also include a logic circuit die comprising combinatorial logic circuits configured to receive the second data. The apparatus may further include an optical via coupled between the memory circuit die and the logical circuit die and configured to transfer second data between the memory circuit die and the logic circuit die.

According to one general aspect, an apparatus may include a memory circuit die configured to store a lookup table that converts first data to second data. The apparatus may also include a logic circuit die comprising combinatorial logic circuits configured to receive the second data. The apparatus may further include an optical via coupled between the memory circuit die and the logical circuit die and configured to transfer second data between the memory circuit die and the logic circuit die.