The invention provides a photoelectric energy conversion device applied to a power conversion circuit to replace a magnetic component which is widely used in a power conversion circuit. The photoelectric energy conversion device includes a shell, at least one light generator, and at least one photovoltaic generator, wherein the at least one light generator and the at least one photovoltaic generator are packaged in the shell. The at least one photovoltaic generator receives light generated in the shell by the at least one light generator and generates electric energy based on the light, and the at least one photovoltaic generator serves as a power supply source for a back-end circuit of the photoelectric energy conversion device.

The invention provides a photoelectric energy conversion device applied to a power conversion circuit to replace a magnetic component which is widely used in a power conversion circuit. The photoelectric energy conversion device includes a shell, at least one light generator, and at least one photovoltaic generator, wherein the at least one light generator and the at least one photovoltaic generator are packaged in the shell. The at least one photovoltaic generator receives light generated in the shell by the at least one light generator and generates electric energy based on the light, and the at least one photovoltaic generator serves as a power supply source for a back-end circuit of the photoelectric energy conversion device.

Methods and devices for forming painted circuits using multiple layers of electrically conductive paint. In one aspect, a painted circuit includes a substrate (111) and one or more paint layer (106, 108, 110, 112, 114, 116, 120, 122) applied to the substrate, where the one or more paint layers each form an electrical component of the painted circuit. A given paint layer of the one or more paint layers includes a conductive paint formulation having a resistance that is defined by a concentration of conductive material that is included in the conductive paint formulation and a thickness of the given paint layer, and lower concentrations of the conductive material included in the conductive paint formulation provide a higher resistance than higher concentrations of conductive material.

The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

A light sensing packaging structure and a packaging method thereof is provided, wherein the light sensing packaging structure comprises a substrate provided with a through-hole between a light-emitting element and a light-sensing element; and a cover body covered the substrate. The cover body comprises a shielding part and an extended part. The shielding part is mounted between the light-emitting element and the light-sensing element, and provided with a metal bonding layer on a surface towards the substrate. The extended part is provided with a metal side wall connected to the metal bonding layer. The through-hole is covered with a conductive glue, and the metal junction contacts the conductive glue. Hereby, the present application may reduce the size of the light sensing device, provide a stable packaging, reduce the packaging cost and improve the reliability of the light sensing product.

A display panel and an electronic device. The display panel includes a substrate; a thin film transistor layer, the thin film transistor layer is located on the substrate; a light emitting layer, the light emitting layer is located on the thin film transistor layer, the light emitting layer includes a plurality of pixel points; the light emitting layer further includes a plurality of concentrating units, each of the concentrating units being located between two adjacent pixel points, and spaced apart from the pixel points.

The present invention relates to a display panel, an electronic device, and an operation method of the electronic device. The display panel is divided into a display region and a plurality of image capturing regions. Each of the image capturing regions includes: a camera module; a pixel module disposed on the camera module; and the pixel module includes a plurality of sub-pixel units, each of the sub-pixel units spaced apart on the camera module. By adding a plurality of cameras hidden under the display panel, the invention can not only improve accuracy of eye-tracking technology, but also prevent the problem of reduced appearance aesthetics caused by the plurality of cameras.

An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.

An optical sensor includes a light emitter to emit light, a light receiver to receive the light emitted from the light emitter, a first resin body that covers the light emitter and the light receiver to transmit the light emitted from the light emitter to emit the light outside, and a second resin body that seals the light emitter and the light receiver, in which the second resin body is included inside the first resin body, and the second resin body is harder than the first resin body.

One embodiment of the present invention is a transparent sensing device comprising: a transparent substrate; a microsensor arranged on the transparent substrate and having an area of 250,000 μm.sup.2 or less; a plurality of wirings connected to the microsensor; and a sealing layer covering the microsensor arranged on the transparent substrate and the plurality of wirings. The sealing layer is a transparent resin having a water absorption rate of 1% or less after curing. Therefore, it is possible to provide a transparent sensing device in which migration of wirings is suppressed and which has excellent reliability.