A semiconductor light emitting element according to an embodiment of the present disclosure includes: a n-type semiconductor layer; a p-type semiconductor layer formed in a first region on the n-type semiconductor layer; a p-type electrode formed on the p-type semiconductor layer; a n-type electrode formed in a second region different from the first region on the n-type semiconductor layer; and a magnetic layer formed under the n-type semiconductor layer.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

A proximity sensor includes a substrate, a light source, a finger electrode, an active layer, and a transparent electrode layer. The substrate has opposite top and bottom surfaces. The light source faces toward the bottom surface of the substrate. The finger electrode is located on the top surface of the substrate, and has finger portions and gaps between every two adjacent finger portions. The active layer covers the finger electrode, and is located in the gaps. The transparent electrode layer is located on the active layer. When the light source emits light, the light through the gaps sequentially passes through the active layer and the transparent electrode layer onto a reflective surface. The light is reflected by the reflective surface to form reflected light, and the reflected light passes through the transparent electrode layer and is received by the active layer.

An electronic device, according to one embodiment of the present invention, comprises: an antenna; and a photo conductive device electrically connected to the antenna, wherein the photo conductive device may comprise: a first layer including a plurality of conductive elements disposed to be spaced apart at a specified interval; a second layer disposed above the first layer and including at least one light source capable of outputting light; and a third layer disposed between the first layer and the second layer and having a photo conductive member of which at least a portion is changed, by means of the light, to be conductive in order to electrically connect at least a portion of the plurality of conductive elements. Various other embodiments may be included.

A display device includes a TFT layer, a light-emitting element layer provided in an upper layer than the TFT layer and including a first electrode, a second electrode, and a light-emitting layer of visible light, and a sealing layer covering the light-emitting element layer. An infrared light emission layer and an infrared light detection element are provided in a lower layer than the sealing layer.

An electronic device is provided. The electronic device includes a substrate and the electronic device also includes a light-emitting element, a sensing element and a black matrix disposed on the substrate. The sensing element is disposed adjacent to the light-emitting element. The black matrix has a plurality of openings and a light-shielding portion. The electronic device further includes a driving element disposed adjacent to and electrically connected to the light-emitting element. The sensing element includes a first thin-film transistor, and the driving element includes a second thin-film transistor. In a normal direction of the substrate, one of the openings is disposed corresponding to the sensing element, and the light-shielding portion is disposed corresponding to the driving element.

An electronic device is provided. The electronic device includes a substrate and the electronic device also includes a light-emitting element, a sensing element and a black matrix disposed on the substrate. The sensing element is disposed adjacent to the light-emitting element. The black matrix has a plurality of openings and a light-shielding portion. The electronic device further includes a driving element disposed adjacent to and electrically connected to the light-emitting element. The sensing element includes a first thin-film transistor, and the driving element includes a second thin-film transistor. In a normal direction of the substrate, one of the openings is disposed corresponding to the sensing element, and the light-shielding portion is disposed corresponding to the driving element.

A light-emitting device includes: a first light-emitting element array that includes plural first light-emitting elements arranged at a first interval; a second light-emitting element array that includes plural second light-emitting elements arranged at a second interval wider than the first interval, second light-emitting element array being configured to output a light output larger than a light output of the first light-emitting element array, and being configured to be driven independently from the first light-emitting element array; and a light diffusion member provided on an emission path of the second light-emitting element array.

A novel authentication system is provided. In addition, a method for recording an unlocking history is provided. The authentication system includes an arithmetic device and an input/output device. The arithmetic device supplies first control data and second control data, and is supplied with a sensor signal. The input/output device includes an electric lock and a reading portion, and the electric lock is unlocked on the basis of the second control data. The reading portion is supplied with the first control data, supplies the sensor signal, and includes a light-emitting element and a pixel array. The light-emitting element emits light including infrared rays, the pixel array includes pixels, the pixels each include an imaging circuit and a photoelectric conversion element, the imaging circuit is electrically connected to the photoelectric conversion element, the imaging circuit includes a transistor, and the transistor includes an oxide semiconductor film.