Patent classifications
H01L31/12
LIGHT-EMITTING DEVICE AND MEASUREMENT DEVICE
A light-emitting device includes one or more light-emitting units each including a light-emitting element including a function of a thyristor; an electrode for light emission to which a first voltage is applied for light emission of the light-emitting unit; and one or more light emission permission thyristors that permit the light-emitting element to emit light by a second voltage that is lower than the first voltage and set irrespective of the first voltage.
FINGERPRINT IDENTIFICATION SENSOR, DISPLAY SUBSTRATE, DISPLAY DEVICE AND FINGERPRINT IDENTIFICATION METHOD
A fingerprint identification sensor includes a base, and at least one light sensing unit disposed on the base. The at least one light sensing unit is configured to collect at least two different monochromatic lights of light reflected by a finger to identify a fingerprint.
DYNAMICALLY ADDRESSABLE HIGH VOLTAGE OPTICAL TRANSFORMER WITH INTEGRATED OPTICALLY TRIGGERED SWITCHES
An optical transformer includes a plurality of light emitters, a plurality of photovoltaic cells positioned to receive light from at least a first subset of the plurality of light emitters, the plurality of photovoltaic cells including at least a first photovoltaic cell and a second photovoltaic cell, and one or more optically triggered switches positioned to receive light from at least a second subset of the plurality of light emitters, the one or more optically triggered switches including at least a first optically triggered switch electrically coupled to the first photovoltaic cell and the second photovoltaic cell. A method of operating the optical transformer is also described.
SYSTEM AND METHODS FOR MANAGING HEAT IN A PHOTONIC INTEGRATED CIRCUIT
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
SYSTEM AND METHODS FOR MANAGING HEAT IN A PHOTONIC INTEGRATED CIRCUIT
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND VEHICLE
An imaging device or a display device that is capable of clearly capturing an image of a fingerprint or the like can be provided. The display device includes a light-receiving element, a light-emitting element, a first substrate, a second substrate, a first resin layer, a second resin layer, and a light-blocking layer. The first resin layer, the second resin layer, and the second substrate are stacked over the first substrate. The light-receiving element and the light-emitting element are positioned between the first substrate and the first resin layer. The light-blocking layer is positioned between the first resin layer and the second resin layer and includes an opening portion overlapping with the light-receiving element. The opening portion in the light-blocking layer is positioned on an inner side of a light-receiving region of the light-receiving element in a plan view, and the width of the opening portion is less than or equal to the width of the light-receiving region. The second substrate is thicker than the first resin layer and the second resin layer. The thickness of a portion of the first resin layer, which overlaps with the light-receiving region of the light-receiving element, is greater than or equal to one time and less than or equal to 10 times as large as the width of the light-receiving region. The second substrate has a higher refractive index than the first resin layer and the second resin layer.
OPTICAL MODULE
The present technology relates to an optical module capable of improving performance of the optical module including a light emitting element and a light receiving element.
An optical module includes: a substrate; a light emitting element that is disposed on the substrate; a light receiving element that is disposed on the substrate at a predetermined interval from the light emitting element; a first casing that is disposed on the substrate and surrounds a periphery of the light emitting element; a second casing that is disposed on the substrate and surrounds a periphery of the light receiving element; a light emitting lens that is housed in the first casing and is disposed on an optical axis of the light emitting element; and a light receiving lens that is housed in the second casing and is disposed on an optical axis of the light receiving element, in which a first diameter of one lens out of the light emitting lens and the light receiving lens in a first direction toward an optical axis of the other lens with reference to an optical axis of the one lens is shorter than a second diameter of the one lens in a second direction that is orthogonal to the first direction. The present technology can be applied to a distance measuring sensor, for example.
ELECTRONIC PACKAGE, OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.
ELECTRONIC PACKAGE, OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.
Device including optofluidic sensor with integrated photodiode
A “lab on a chip” includes an optofluidic sensor and components to analyze signals from the optofluidic sensor. The optofluidic sensor includes a substrate, a channel at least partially defined by a portion of a layer of first material on the substrate, input and output fluid reservoirs in fluid communication with the channel, at least a first radiation source coupled to the substrate adapted to generate radiation in a direction toward the channel, and at least one photodiode positioned adjacent and below the channel.