A substrate for light-emitting diode, a backlight module and a display device are disclosed. The substrate for light-emitting diode includes a plurality of light-emitting sub-regions, and each of the plurality of light-emitting sub-regions includes at least two anode electrode pads electrically connected through a first parallel-connection line, and at least two cathode electrode pads electrically connected through a second parallel-connection line. The at least two cathode electrode pads are disposed in one-to-one correspondence with the at least two anode electrode pads. At least one series-connection electrode pad group is further disposed between the anode electrode pad and the cathode electrode pad which are corresponding to each other; and each of the at least one series-connection electrode pad group includes two series electrode pads which are electrically connected through a series-connection line.

A light-emitting diode device includes a first-type semiconductor layer, a second-type semiconductor layer, a light-emitting layer, a current distribution layer and a high-dielectric-constant insulation layer. The light-emitting layer is located between the first-type and the second-type semiconductor layers. The current distribution layer is located above the second-type semiconductor layer. The high-dielectric-constant insulation layer is formed uniformly between the current distribution layer and the second-type semiconductor layer.

A light-emitting diode device includes a first-type semiconductor layer, a second-type semiconductor layer, a light-emitting layer, a current distribution layer and a high-dielectric-constant insulation layer. The light-emitting layer is located between the first-type and the second-type semiconductor layers. The current distribution layer is located above the second-type semiconductor layer. The high-dielectric-constant insulation layer is formed uniformly between the current distribution layer and the second-type semiconductor layer.

A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (LED), a first conductive layer, and a second conductive layer. A light emitting surface of the LED is away from the substrate. The LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (LED), a first conductive layer, and a second conductive layer. A light emitting surface of the LED is away from the substrate. The LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

The invention describes a flexible lighting strip comprising a multitude of light-emitting diodes arranged in at least two groups. Each group comprises at least two light-emitting diodes arranged in an electrical series connection. The at least two groups are arranged in parallel to an anode track and a cathode track. The at least two groups are arranged in a longitudinal arrangement such that a last light-emitting diode of a first group is arranged next to a first light-emitting diode of a second group. The anode track and the cathode track each consist of a wire line having substantially circular wires that are bent to receive compressive and/or tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines. At least one light-emitting diode of every group is mounted on an interposer which contracts all three wire lines.

The invention describes a flexible lighting strip comprising a multitude of light-emitting diodes arranged in at least two groups. Each group comprises at least two light-emitting diodes arranged in an electrical series connection. The at least two groups are arranged in parallel to an anode track and a cathode track. The at least two groups are arranged in a longitudinal arrangement such that a last light-emitting diode of a first group is arranged next to a first light-emitting diode of a second group. The anode track and the cathode track each consist of a wire line having substantially circular wires that are bent to receive compressive and/or tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines. At least one light-emitting diode of every group is mounted on an interposer which contracts all three wire lines.

A light emitting device includes: a base member having a first surface including a first region and a second region; a first frame surrounding the first region on the base member; a light emitting element provided on the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; a second frame surrounding the second region; an electronic component provided in the second region; and a non-light-transmissive second member provided inward of the second frame, and covering the electronic component. A part of the first frame and a part of the second frame are integrated with each other. An upper surface of the first member is positioned higher than upper surfaces of the first frame, the second frame, and the second member.