A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.

A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.

A display device includes a substrate, a first electrode on the substrate, a light emitting element including: a first contact electrode connected to the first electrode, a first semiconductor layer on the first contact electrode, an active layer on the first semiconductor layer, a second semiconductor layer on the active layer, and a second contact electrode on the second semiconductor layer, a second electrode on the light emitting element, and a color conversion layer on the light emitting element and the second electrode, wherein an upper surface of the second contact electrode has a concavo-convex pattern.

A display device includes a substrate, a first electrode on the substrate, a light emitting element including: a first contact electrode connected to the first electrode, a first semiconductor layer on the first contact electrode, an active layer on the first semiconductor layer, a second semiconductor layer on the active layer, and a second contact electrode on the second semiconductor layer, a second electrode on the light emitting element, and a color conversion layer on the light emitting element and the second electrode, wherein an upper surface of the second contact electrode has a concavo-convex pattern.

A light-emitting element disclosed according to an embodiment may comprise: a substrate comprising a body, a plurality of lead electrodes arranged over the body in a first axial direction, and a heat-radiating frame and a plurality of lead frames arranged below the body in a second axial direction; and a light-emitting chip arranged on a first lead electrode, which is arranged in the central area of the body among the plurality of lead electrodes, and electrically connected with the plurality of lead electrodes. The plurality of lead electrodes have a large length in the second axial direction, the heat-radiating frame is arranged in the central area below the body, and the heat-radiating frame and the plurality of lead frames have a large length in the first axial direction and may vertically overlap with the plurality of lead electrodes.

A light-emitting element disclosed according to an embodiment may comprise: a substrate comprising a body, a plurality of lead electrodes arranged over the body in a first axial direction, and a heat-radiating frame and a plurality of lead frames arranged below the body in a second axial direction; and a light-emitting chip arranged on a first lead electrode, which is arranged in the central area of the body among the plurality of lead electrodes, and electrically connected with the plurality of lead electrodes. The plurality of lead electrodes have a large length in the second axial direction, the heat-radiating frame is arranged in the central area below the body, and the heat-radiating frame and the plurality of lead frames have a large length in the first axial direction and may vertically overlap with the plurality of lead electrodes.

Described is an arrangement and system for precise angular and directional positioning of light-emitting diodes (LED). An LED component includes a base body with a light-emitting region, a first connector, and a second connector, where the connectors are electrically conductively connected to the light-emitting region. The base body includes at least two fixing regions and the connectors each include a bending portion and a contact area for surface mounting. Each of the bending portions is arranged between the base body and the contact area. A supporting frame includes a plinth region to align the supporting frame on a surface and includes an outwardly open recess, a support region to receive a component in the supporting frame and at least two fixing elements to fix the component above the support region. A base area of the plinth region and a base area of the support region enclose an acute angle.

Described is an arrangement and system for precise angular and directional positioning of light-emitting diodes (LED). An LED component includes a base body with a light-emitting region, a first connector, and a second connector, where the connectors are electrically conductively connected to the light-emitting region. The base body includes at least two fixing regions and the connectors each include a bending portion and a contact area for surface mounting. Each of the bending portions is arranged between the base body and the contact area. A supporting frame includes a plinth region to align the supporting frame on a surface and includes an outwardly open recess, a support region to receive a component in the supporting frame and at least two fixing elements to fix the component above the support region. A base area of the plinth region and a base area of the support region enclose an acute angle.

A display apparatus including a display panel including a base substrate and a first pad electrode on a first pad portion of the base substrate, a flexible substrate connected to the first pad portion, and a driving chip electrically connected to the flexible substrate. The flexible substrate includes a first film layer, a first wiring layer on the first film layer and comprising a plurality of wirings, a second film layer on the first wiring layer, and a second wiring layer on the second film layer and comprising a plurality of wirings. The wirings of the second wiring layer include a first_first wiring and a first_second wiring, the first_first wiring and the first_second wiring extend in a same direction along a same line and are spaced from each other by a gap therebetween. The gap is at an edge of the base substrate in a plan view.

A light emitting device includes: a substrate; a first electrode on the substrate; a metal member on the first electrode and having an cavity; a first insulating layer on the metal member and exposing the cavity therethrough; a bar-type LED having a first end portion and a second end portion; and a second electrode on the first insulating layer. The first end portion of the bar-type LED is in the cavity and electrically connected to the first electrode, and the second end portion of the bar-type LED protrudes outside of the cavity and is electrically connected to the second electrode.