A light-emitting device of the present disclosure includes: at least one first semiconductor layer of one conductivity type; a plurality of active layers laminated on the first semiconductor layer; a plurality of second semiconductor layers of another conductivity type, the plurality of second semiconductor layers being laminated on the plurality of active layers; and a plurality of electrodes connected to the at least one first semiconductor layer and the plurality of second semiconductor layers. Some electrodes of the plurality of electrodes are opposed to each other, with the plurality of active layers lying in between, and the other electrodes of the plurality of electrodes are located in a region between the some electrodes of the plurality of electrodes.

A light-emitting device of the present disclosure includes: at least one first semiconductor layer of one conductivity type; a plurality of active layers laminated on the first semiconductor layer; a plurality of second semiconductor layers of another conductivity type, the plurality of second semiconductor layers being laminated on the plurality of active layers; and a plurality of electrodes connected to the at least one first semiconductor layer and the plurality of second semiconductor layers. Some electrodes of the plurality of electrodes are opposed to each other, with the plurality of active layers lying in between, and the other electrodes of the plurality of electrodes are located in a region between the some electrodes of the plurality of electrodes.

One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

A visible light communication emission device with improved response frequency is provided, comprising a substrate, wherein an inductance coil module is provided on the substrate, a LED chip matrix formed by series connection of a plurality of LED chips is provided on the inductance coil module, and the inductance coil module and the LED chip matrix are connected in series, wherein inductance value L of the inductance coil module is configured to be: L=1/(.sup.2C), with C representing capacity in the device provided by LED chips and representing frequency, wherein the inductance coil module comprises more than one inductance coil whose composition materials from inside to outside are successively Cr, Al, Cr, Ti, and Ag.

LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Provided is a light-emitting element package, one embodiment comprising: a substrate; a light-emitting element disposed on the substrate; and a molded part surrounding the side surfaces and the top surface of the light-emitting element and having patterns on a surface from which the light incident thereto from the light-emitting element is output, wherein a part of the patterns correspond to a first area corresponding to the light-emitting element, and to a second area around the first area and are arranged at an angular range of 120 to 130 degrees on the surface of the molded part.

Provided is a light-emitting element package, one embodiment comprising: a substrate; a light-emitting element disposed on the substrate; and a molded part surrounding the side surfaces and the top surface of the light-emitting element and having patterns on a surface from which the light incident thereto from the light-emitting element is output, wherein a part of the patterns correspond to a first area corresponding to the light-emitting element, and to a second area around the first area and are arranged at an angular range of 120 to 130 degrees on the surface of the molded part.