Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

A high-efficiency light-emitting device of the present invention includes: a nitride-based semiconductor laminate layer comprising a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; a substrate comprising a first electrode and a second electrode each connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, a first pad electrode and a second pad electrode each connected with the first electrode and the second electrode, and a first connection pad and a second connection pad each connected with the first pad electrode and the second pad electrode; and a solder positioned between the pad electrodes and the connection pads.

A high-efficiency light-emitting device of the present invention includes: a nitride-based semiconductor laminate layer comprising a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; a substrate comprising a first electrode and a second electrode each connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, a first pad electrode and a second pad electrode each connected with the first electrode and the second electrode, and a first connection pad and a second connection pad each connected with the first pad electrode and the second pad electrode; and a solder positioned between the pad electrodes and the connection pads.

A light emitting module according to an embodiment comprises: a first support member having a first opening part and a second opening part; a second support member disposed in the first opening part in the first support member; a third support member disposed in the second opening part in the first support member; a first lead electrode disposed above the second support member; a second lead electrode disposed on the first support member and/or above the second support member; a light emitting chip disposed above the second support member and electrically connected to the first and second lead electrodes; a control component disposed above the third support member; and a conductive layer disposed underneath the first, second and third support members, wherein the first support member comprises a resin material, the second support material comprises a ceramic material and the third support member comprises a metal material.

A light emitting module according to an embodiment comprises: a first support member having a first opening part and a second opening part; a second support member disposed in the first opening part in the first support member; a third support member disposed in the second opening part in the first support member; a first lead electrode disposed above the second support member; a second lead electrode disposed on the first support member and/or above the second support member; a light emitting chip disposed above the second support member and electrically connected to the first and second lead electrodes; a control component disposed above the third support member; and a conductive layer disposed underneath the first, second and third support members, wherein the first support member comprises a resin material, the second support material comprises a ceramic material and the third support member comprises a metal material.

The present invention provides a method for manufacturing a color micro LED array substrate, in which a plurality of monochromic micro LED arrays of different colors are formed on a receiving substrate to form a color micro LED array, wherein making of the monochromic micro LED array of each of the colors is conducted in combination with a bonding technique and a laser lift-off technique and metal electrodes are selectively formed on the micro LEDs in a specific zone of the supply substrate so that the micro LEDs in the specific zone can be selectively bonded to the receiving substrate and laser irradiation is selectively made on the micro LEDs in the specific zone to allow the micro LEDs of the specific zone, after the bonding and laser annealing, to separate from the supply substrate to thereby form the monochromic micro LED array on the receiving substrate to realize fabrication of monochromic micro LED arrays of different colors on the receiving substrate, and the method of fabrication is easy to carry out.

The present invention provides a method for manufacturing a color micro LED array substrate, in which a plurality of monochromic micro LED arrays of different colors are formed on a receiving substrate to form a color micro LED array, wherein making of the monochromic micro LED array of each of the colors is conducted in combination with a bonding technique and a laser lift-off technique and metal electrodes are selectively formed on the micro LEDs in a specific zone of the supply substrate so that the micro LEDs in the specific zone can be selectively bonded to the receiving substrate and laser irradiation is selectively made on the micro LEDs in the specific zone to allow the micro LEDs of the specific zone, after the bonding and laser annealing, to separate from the supply substrate to thereby form the monochromic micro LED array on the receiving substrate to realize fabrication of monochromic micro LED arrays of different colors on the receiving substrate, and the method of fabrication is easy to carry out.

light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.

light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.