A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs.

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

The present disclosure relate to a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises a semiconductor light emitting chip, and first electrodes electrically connected to the semiconductor light emitting chip, with the first electrodes each having a planar area larger than that of the semiconductor light emitting chip, wherein lower surfaces of the first electrodes are exposed externally, and an insulating material is filled in-between inner lateral surfaces of the first electrodes.

An electronic device is provided. The electronic device includes a substrate and another substrate disposed opposite to the substrate. The electronic device includes a first light-emitting element disposed on the substrate and configured to emit blue light under a first current density when the substrate provides a first current to the first light-emitting element. The electronic device includes a second light-emitting element disposed on the substrate and configured to emit green light or red light under a second current density when the substrate provides a second current to the second light-emitting element. The electronic device includes a protective layer disposed between the substrate and the another substrate and covering the first light-emitting element and the second light-emitting element. The electronic device includes an adhesive layer disposed between the protective layer and the another substrate.

An electronic device is provided. The electronic device includes a substrate and another substrate disposed opposite to the substrate. The electronic device includes a first light-emitting element disposed on the substrate and configured to emit blue light under a first current density when the substrate provides a first current to the first light-emitting element. The electronic device includes a second light-emitting element disposed on the substrate and configured to emit green light or red light under a second current density when the substrate provides a second current to the second light-emitting element. The electronic device includes a protective layer disposed between the substrate and the another substrate and covering the first light-emitting element and the second light-emitting element. The electronic device includes an adhesive layer disposed between the protective layer and the another substrate.

A lighting device includes a light source positive electrode, light source negative electrode, driving power source, substrate, first connecting portion, second connecting portion and light-emitting module. The driving power source has a power source positive electrode and power source negative electrode. The substrate has a light source connecting portion and electrical connecting portion connected to each other. The electrical connecting portion is connected to the power source negative electrode. One end of the first connecting portion is connected to the power source positive electrode. The two ends of the second connecting portion are connected to the other end of the first connecting portion and the light source positive electrode. The light-emitting module includes a first light source module and a second light source module. The first light source module and the second light source module are connected to the light source positive electrode and the light source connecting portion.

A lighting device includes a light source positive electrode, light source negative electrode, driving power source, substrate, first connecting portion, second connecting portion and light-emitting module. The driving power source has a power source positive electrode and power source negative electrode. The substrate has a light source connecting portion and electrical connecting portion connected to each other. The electrical connecting portion is connected to the power source negative electrode. One end of the first connecting portion is connected to the power source positive electrode. The two ends of the second connecting portion are connected to the other end of the first connecting portion and the light source positive electrode. The light-emitting module includes a first light source module and a second light source module. The first light source module and the second light source module are connected to the light source positive electrode and the light source connecting portion.

A micro-display LED chip structure includes: a first substrate; and an LED semiconductor layer disposed on the first substrate. The LED semiconductor layer includes a plurality of LED units arranged in an array, and adjacent LED units are capable of being driven independently. The first substrate includes a driving circuit, the driving circuit is provided with a plurality of contacts, each contact of the plurality of contacts corresponds to an LED unit, the contact is located in an orthographic projection region, on the first substrate, of the LED unit corresponding to the contact, and the contact is electrically connected to the LED unit. The micro-display LED chip structure according to embodiments of the present disclosure may reduce a distance between two adjacent LED units, and improve an area of a light-emitting region of the LED unit, thereby improving a light-emitting brightness of the micro-display LED chip structure.

A micro-display LED chip structure includes: a first substrate; and an LED semiconductor layer disposed on the first substrate. The LED semiconductor layer includes a plurality of LED units arranged in an array, and adjacent LED units are capable of being driven independently. The first substrate includes a driving circuit, the driving circuit is provided with a plurality of contacts, each contact of the plurality of contacts corresponds to an LED unit, the contact is located in an orthographic projection region, on the first substrate, of the LED unit corresponding to the contact, and the contact is electrically connected to the LED unit. The micro-display LED chip structure according to embodiments of the present disclosure may reduce a distance between two adjacent LED units, and improve an area of a light-emitting region of the LED unit, thereby improving a light-emitting brightness of the micro-display LED chip structure.