Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.

The embodiment relates to a light emitting device, a method of fabricating the same, a light emitting device package, and a lighting system. According to the embodiment, a light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first electrode electrically connected with the first conductive semiconductor layer, a second electrode electrically connected with the second conductive semiconductor layer, an insulating member provided on the light emitting structure while exposing the first electrode and the second electrode, a third electrode provided on the first electrode, and a fourth electrode provided on the second electrode. The third electrode includes a first part of the third electrode directly making contact with the first electrode and a second part of the third electrode, which is provided on the first part of the third electrode and has a horizontal width wider than the first part of the third electrode, and the fourth electrode includes a first part of the fourth electrode directly making contact with the second electrode and a second part of the fourth electrode, which is provided on the first part of the fourth electrode and has a horizontal width wider than the first part of the fourth electrode. The light extraction efficiency and the heat radiation characteristic may be improved, and the reliability may be improved.

The embodiment relates to a light emitting device, a method of fabricating the same, a light emitting device package, and a lighting system. According to the embodiment, a light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first electrode electrically connected with the first conductive semiconductor layer, a second electrode electrically connected with the second conductive semiconductor layer, an insulating member provided on the light emitting structure while exposing the first electrode and the second electrode, a third electrode provided on the first electrode, and a fourth electrode provided on the second electrode. The third electrode includes a first part of the third electrode directly making contact with the first electrode and a second part of the third electrode, which is provided on the first part of the third electrode and has a horizontal width wider than the first part of the third electrode, and the fourth electrode includes a first part of the fourth electrode directly making contact with the second electrode and a second part of the fourth electrode, which is provided on the first part of the fourth electrode and has a horizontal width wider than the first part of the fourth electrode. The light extraction efficiency and the heat radiation characteristic may be improved, and the reliability may be improved.

The present invention discloses a light emitting element and a fabrication method thereof. The light emitting element includes: an anode electrode, a hole transport layer, a light emitting layer, an electron transport layer and a cathode electrode, all of the light emitting units are divided into a plurality of light emitting sets, each light emitting set includes at least two light emitting units and the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode. In the technical solutions of the present invention, all of the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode, thus effectively reducing the number of the cathode electrodes.

The present invention discloses a light emitting element and a fabrication method thereof. The light emitting element includes: an anode electrode, a hole transport layer, a light emitting layer, an electron transport layer and a cathode electrode, all of the light emitting units are divided into a plurality of light emitting sets, each light emitting set includes at least two light emitting units and the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode. In the technical solutions of the present invention, all of the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode, thus effectively reducing the number of the cathode electrodes.

An integrated light-emitting package according to an embodiment comprises: a light-emitting element layer including a plurality of light-emitting units arranged at predetermined intervals; an optical conversion substrate disposed along the upper portion of the light-emitting device layer; and a first adhesive member disposed in each gap between the light-emitting units.

An integrated light-emitting package according to an embodiment comprises: a light-emitting element layer including a plurality of light-emitting units arranged at predetermined intervals; an optical conversion substrate disposed along the upper portion of the light-emitting device layer; and a first adhesive member disposed in each gap between the light-emitting units.

In a flip chip type light-emitting diode, a light-emitting diode structure possesses one unique layer with properties of both thermal conduction and electrical isolation disposed on its second contact metal layer. A first dielectric layer covers the light-emitting diode structure. A first-level metal interconnect is divided into three blocks, which are disposed on the first dielectric layer and are respectively connected to a first contact metal layer, the second contact metal layer, and the insulated heat-transfer layer. A first bonding pad structure, a second bonding pad structure, and a heat-dissipating pad structure, forming a second-level interconnect metal layer, are disposed on a second dielectric layer and respectively connected to the blocks of the first-level metal interconnect. The first bonding pad structure, the second bonding pad structure, and the heat-dissipating pad structure are respectively disposed on a first electrode, a second electrode, and a heat-dissipating electrode of a circuit board.

In a flip chip type light-emitting diode, a light-emitting diode structure possesses one unique layer with properties of both thermal conduction and electrical isolation disposed on its second contact metal layer. A first dielectric layer covers the light-emitting diode structure. A first-level metal interconnect is divided into three blocks, which are disposed on the first dielectric layer and are respectively connected to a first contact metal layer, the second contact metal layer, and the insulated heat-transfer layer. A first bonding pad structure, a second bonding pad structure, and a heat-dissipating pad structure, forming a second-level interconnect metal layer, are disposed on a second dielectric layer and respectively connected to the blocks of the first-level metal interconnect. The first bonding pad structure, the second bonding pad structure, and the heat-dissipating pad structure are respectively disposed on a first electrode, a second electrode, and a heat-dissipating electrode of a circuit board.

A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.