This disclosure discloses a display including a first carrier, a second carrier, a light-emitting unit, a frame, and a protective layer. The first carrier includes a first electrode and a second electrode. The second carrier is arranged below the first carrier and includes a first connection pad and a second connection pad arranged on a side of the second carrier close to the first carrier. The light-emitting unit is arranged on the first carrier. The frame surrounds the light-emitting unit, and the protective layer covers the light-emitting unit. A distance between the first electrode and the second electrode is smaller than that between the first connection pad and the second connection pad.

A display device comprises a substrate comprising a first contact hole, a barrier insulating layer disposed on the substrate and comprising a second contact hole, a fan-out line disposed in a first metal layer on the barrier insulating layer and comprising a pad part inserted into the second contact hole, a display layer disposed on the fan-out line, and a flexible film disposed below the substrate and having a lead electrode which is inserted into the first contact hole and bonded to the pad part. The pad part comprises a first base, a first protrusion integral with the first base and protruding from the first base, and a second protrusion protruding from the first protrusion.

A display device comprises a substrate comprising a first contact hole, a barrier insulating layer disposed on the substrate and comprising a second contact hole, a fan-out line disposed in a first metal layer on the barrier insulating layer and comprising a pad part inserted into the second contact hole, a display layer disposed on the fan-out line, and a flexible film disposed below the substrate and having a lead electrode which is inserted into the first contact hole and bonded to the pad part. The pad part comprises a first base, a first protrusion integral with the first base and protruding from the first base, and a second protrusion protruding from the first protrusion.

A method of manufacturing a light-emitting element includes: providing a substrate, wherein the substrate includes a top surface with a first area and a second area; introducing a semiconductor material to form a first layer on the first area and a second layer on the second area, wherein the first layer includes a first crystal quality and the second layer includes a second crystal quality, the first crystal quality is different from the second crystal quality; and dicing the substrate along the second area.

A method of manufacturing a light-emitting element includes: providing a substrate, wherein the substrate includes a top surface with a first area and a second area; introducing a semiconductor material to form a first layer on the first area and a second layer on the second area, wherein the first layer includes a first crystal quality and the second layer includes a second crystal quality, the first crystal quality is different from the second crystal quality; and dicing the substrate along the second area.

Disclosed in an embodiment is a semiconductor device comprising: a semiconductor structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a second electrode electrically connected to the second conductive type semiconductor layer; and a reflective layer disposed under the second electrode, wherein the second conductive type semiconductor layer comprises a first sub-layer and a second sub-layer disposed between the first sub-layer and the active layer and having an aluminum (Al) composition higher than that of the first sub-layer, the reflective layer comes into contact with the lower surface of the second sub-layer, and the second electrode comes into contact with the first sub-layer.

A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate, and the first semiconductor layer adjacent to the second edge includes a second sidewall separated from the second side surface of the substrate by a distance.

A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate, and the first semiconductor layer adjacent to the second edge includes a second sidewall separated from the second side surface of the substrate by a distance.

A light-emitting element producing method includes: a step of forming a first-charge transport layer on a first electrode; a step of applying a first photosensitive resin composition, containing first quantum dots, to the first-charge transport layer, and forming a first-quantum-dot containing layer; a step of applying a second photosensitive resin composition, containing second quantum dots, to the first-quantum-dot containing layer, and forming a second-quantum-dot containing layer; a step of forming a second-charge transport layer on the second-quantum-dot containing layer; and a step of forming a second electrode on the second-charge transport layer.

A light-emitting element producing method includes: a step of forming a first-charge transport layer on a first electrode; a step of applying a first photosensitive resin composition, containing first quantum dots, to the first-charge transport layer, and forming a first-quantum-dot containing layer; a step of applying a second photosensitive resin composition, containing second quantum dots, to the first-quantum-dot containing layer, and forming a second-quantum-dot containing layer; a step of forming a second-charge transport layer on the second-quantum-dot containing layer; and a step of forming a second electrode on the second-charge transport layer.