A light source device includes a mounted substrate which is a multi-layered substrate, a semiconductor light-emitting device which emits a laser beam, a wavelength-converting member which radiates fluorescence by being irradiated with the laser beam emitted from the semiconductor light-emitting device as an excitation light, a state detection circuit, an electric field effect type transistor which adjusts an electric current amount applied to the semiconductor light-emitting device upon receipt of an output from the state detection circuit, and an external connecting member, and the semiconductor light-emitting device, the state detection circuit, the transistor, and the external connecting member are mounted on the single mounted substrate.

A light source device includes a mounted substrate which is a multi-layered substrate, a semiconductor light-emitting device which emits a laser beam, a wavelength-converting member which radiates fluorescence by being irradiated with the laser beam emitted from the semiconductor light-emitting device as an excitation light, a state detection circuit, an electric field effect type transistor which adjusts an electric current amount applied to the semiconductor light-emitting device upon receipt of an output from the state detection circuit, and an external connecting member, and the semiconductor light-emitting device, the state detection circuit, the transistor, and the external connecting member are mounted on the single mounted substrate.

A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Provided are a light-emitting element, a manufacturing method thereof, and a display device comprising the light-emitting element. The method for manufacturing the light-emitting element comprises the steps of: preparing a lower substrate including a substrate and a buffer material layer formed on the substrate, forming a separating layer disposed on the lower substrate and including at least one graphene layer, forming an element deposition structure by depositing a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer on the separating layer, forming an element rod by etching the element deposition structure and the separating layer in a vertical direction; and separating the element rod from the lower substrate to form a light emitting element.

A display device includes a substrate having an emission area and a non-emission area, a first electrode and a second electrode spaced from each other on the substrate in the emission area, a first insulating layer on the substrate in the emission area and the non-emission area and covering at least a portion of the first electrode and the second electrode, a light-emitting element between the first electrode and the second electrode, a first contact electrode on the first electrode and in contact with one end portion of the light-emitting element, and a second contact electrode on the second electrode and in contact with the other end portion of the light-emitting element, a first active material layer on the first insulating layer in the non-emission area and electrically connected to the first contact electrode, and a gate insulating layer on the first active material layer.

A UV-C anti-fouling device that is coupled to power source using a single power supply wire. The device is AC powered, and is capacitively coupled to the conductive surface that is being protected, such as the hull of a ship. The device includes a plurality of UV-C LEDs that are either powered during half-cycles of the AC supply, or powered via individual rectifier circuits, such as a diode bridge, or Graetz bridge. A light guide optically extends the light from the UV-C LEDs. The arrangement is robust against shorts and opens, as well as external inflicted damage.

A UV-C anti-fouling device that is coupled to power source using a single power supply wire. The device is AC powered, and is capacitively coupled to the conductive surface that is being protected, such as the hull of a ship. The device includes a plurality of UV-C LEDs that are either powered during half-cycles of the AC supply, or powered via individual rectifier circuits, such as a diode bridge, or Graetz bridge. A light guide optically extends the light from the UV-C LEDs. The arrangement is robust against shorts and opens, as well as external inflicted damage.

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.