Disclosed are an LED and an LED module. The LED includes: a first conductivity type semiconductor layer; a mesa disposed over the first conductivity type semiconductor layer and including an active layer and a second conductivity type semiconductor layer; a first ohmic-contact structure in contact with the first conductivity type semiconductor layer; a second ohmic-contact structure in contact with the second conductivity type semiconductor layer; a lower insulating layer at least partially covering the mesa and the first conductivity type semiconductor layer and disposed to form a first opening part at least partially exposing the first ohmic-contact structure and a second opening part at least partially exposing the second ohmic-contact structure; and a current distributing layer connected to the first ohmic-contact structure at least partially exposed by the first opening part and disposed to form a third opening part at least partially exposing the second opening part.

A multi-view display device, in which first to third red subpixels configured to display first-first to first-third view images are defined by dividing a red subpixel on which a first organic light emitting layer is deposited, first to third green subpixels configured to display second-first to second-third view images are defined by dividing a green subpixel on which a second organic light emitting layer is deposited, and first to third blue subpixels configured to display third-first to third-third view images are defined by dividing a blue subpixel on which a third organic light emitting layer is formed.

A multi-view display device, in which first to third red subpixels configured to display first-first to first-third view images are defined by dividing a red subpixel on which a first organic light emitting layer is deposited, first to third green subpixels configured to display second-first to second-third view images are defined by dividing a green subpixel on which a second organic light emitting layer is deposited, and first to third blue subpixels configured to display third-first to third-third view images are defined by dividing a blue subpixel on which a third organic light emitting layer is formed.

The present invention relates to a load arrangement for use in an electrical power arrangement and for arrangement at a first external electrically conductive element (5, 50). The load arrangement comprises a load (2), a first electrode (3) electrically connected to the load (2), a dielectric layer (4) and a carrier (80) carrying the load (2), the first electrode (3) and the dielectric layer (4). The load (2), the first electrode (3) and the dielectric layer (4) form a structure, which is configured for being arranged at the first external electrically conductive element (5, 50). The first electrode (3) and the dielectric layer (4) are arranged to form, in combination with a first external electrically conductive element (5, 50) representing an outer surface of a marine structure, a capacitor (6) for capacitive transmission of electrical power between the first electrode (3) and the first external element (5, 50). The carrier (80) is configured for being arranged at the first external electrically conductive element (5, 50). The load (2) is connected to a second electrode (7) electrically insulated from the first electrode (3) or is arranged for being electrically connected to a second external electrically conductive element (10, 11) electrically insulated from the first electrode (3).

The present invention relates to a load arrangement for use in an electrical power arrangement and for arrangement at a first external electrically conductive element (5, 50). The load arrangement comprises a load (2), a first electrode (3) electrically connected to the load (2), a dielectric layer (4) and a carrier (80) carrying the load (2), the first electrode (3) and the dielectric layer (4). The load (2), the first electrode (3) and the dielectric layer (4) form a structure, which is configured for being arranged at the first external electrically conductive element (5, 50). The first electrode (3) and the dielectric layer (4) are arranged to form, in combination with a first external electrically conductive element (5, 50) representing an outer surface of a marine structure, a capacitor (6) for capacitive transmission of electrical power between the first electrode (3) and the first external element (5, 50). The carrier (80) is configured for being arranged at the first external electrically conductive element (5, 50). The load (2) is connected to a second electrode (7) electrically insulated from the first electrode (3) or is arranged for being electrically connected to a second external electrically conductive element (10, 11) electrically insulated from the first electrode (3).

The present invention relates to a load arrangement for use in an electrical power arrangement and for arrangement at a first external electrically conductive element (5, 50). The load arrangement comprises a load (2), a first electrode (3) electrically connected to the load (2), a dielectric layer (4) and a carrier (80) carrying the load (2), the first electrode (3) and the dielectric layer (4). The load (2), the first electrode (3) and the dielectric layer (4) form a structure, which is configured for being arranged at the first external electrically conductive element (5, 50). The first electrode (3) and the dielectric layer (4) are arranged to form, in combination with a first external electrically conductive element (5, 50) representing an outer surface of a marine structure, a capacitor (6) for capacitive transmission of electrical power between the first electrode (3) and the first external element (5, 50). The carrier (80) is configured for being arranged at the first external electrically conductive element (5, 50). The load (2) is connected to a second electrode (7) electrically insulated from the first electrode (3) or is arranged for being electrically connected to a second external electrically conductive element (10, 11) electrically insulated from the first electrode (3).

The present invention relates to a load arrangement for use in an electrical power arrangement and for arrangement at a first external electrically conductive element (5, 50). The load arrangement comprises a load (2), a first electrode (3) electrically connected to the load (2), a dielectric layer (4) and a carrier (80) carrying the load (2), the first electrode (3) and the dielectric layer (4). The load (2), the first electrode (3) and the dielectric layer (4) form a structure, which is configured for being arranged at the first external electrically conductive element (5, 50). The first electrode (3) and the dielectric layer (4) are arranged to form, in combination with a first external electrically conductive element (5, 50) representing an outer surface of a marine structure, a capacitor (6) for capacitive transmission of electrical power between the first electrode (3) and the first external element (5, 50). The carrier (80) is configured for being arranged at the first external electrically conductive element (5, 50). The load (2) is connected to a second electrode (7) electrically insulated from the first electrode (3) or is arranged for being electrically connected to a second external electrically conductive element (10, 11) electrically insulated from the first electrode (3).

A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.

A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.

A micro light-emitting diode (LED) includes an epitaxial layered structure including a support layer, a first-type semiconductor element, an active layer, and a second-type semiconductor element that are sequentially disposed on one another in such order. A method for manufacturing a micro LED device including at least one of the micro LED is also disclosed.