Disclosed herein are systems and methods for reducing surface recombination losses in micro-LEDs. In some embodiments, a method includes increasing a bandgap in an outer region of a semiconductor layer by implanting ions in the outer region of the semiconductor layer and subsequently annealing the outer region of the semiconductor layer to intermix the ions with atoms within the outer region of the semiconductor layer. The semiconductor layer includes an active light emitting layer. A light outcoupling surface of the semiconductor layer has a diameter that is less than twice an electron diffusion length of the semiconductor layer. The outer region of the semiconductor layer extends from an outer surface of the semiconductor layer to a central region of the semiconductor layer that is shaded by a mask during the implanting of the ions.

Eye-tracking systems and methods utilize transparent illumination structures having a plurality of IR μLEDs distributed within the transparent viewing area of illumination structures. The μLEDs are small enough (<100 μm) that they are not visible by a user during use of an HMD or other mixed-reality device, for example, such that they can be positioned within the line-of-sight of the user through the illumination structure and without visibly obscuring or interfering with the user's view of the mixed-reality environment by the mixed-reality device.

Disclosed is a method of facilitating straining of a semiconductor element (331) for semiconductor fabrication. In a described embodiment, the method comprises: providing a base layer (320) with the semiconductor element (331) arranged on a first base portion (321) of the base layer (320), the semiconductor element (331) being subjected to a strain relating to a characteristic of the first base portion (321); and adjusting the characteristic of the first base portion (321) to facilitate straining of the semiconductor element (331).

Disclosed is a method of facilitating straining of a semiconductor element (331) for semiconductor fabrication. In a described embodiment, the method comprises: providing a base layer (320) with the semiconductor element (331) arranged on a first base portion (321) of the base layer (320), the semiconductor element (331) being subjected to a strain relating to a characteristic of the first base portion (321); and adjusting the characteristic of the first base portion (321) to facilitate straining of the semiconductor element (331).

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

A system includes a display. The display includes an array of LEDs covered by a transparent material. The array of LEDs includes a plurality of first, second, third, and fourth LEDs respectively configured to emit red, green, blue, and violet light. The red, green, and blue light from the first, second, and third LEDs is visible to human eye. Violet light from the fourth LEDs is invisible to human eye. The system includes a photocatalytic coating disposed on the transparent material. The photocatalytic coating includes a photo-catalyst responsive to ultraviolet radiation present in sunlight and to the violet light emitted by the fourth LEDs in the array of LEDs. The system includes a controller configured to selectively turn on the fourth LEDs to activate the photo-catalyst in the photocatalytic coating disposed on the transparent material.

A system includes a display. The display includes an array of LEDs covered by a transparent material. The array of LEDs includes a plurality of first, second, third, and fourth LEDs respectively configured to emit red, green, blue, and violet light. The red, green, and blue light from the first, second, and third LEDs is visible to human eye. Violet light from the fourth LEDs is invisible to human eye. The system includes a photocatalytic coating disposed on the transparent material. The photocatalytic coating includes a photo-catalyst responsive to ultraviolet radiation present in sunlight and to the violet light emitted by the fourth LEDs in the array of LEDs. The system includes a controller configured to selectively turn on the fourth LEDs to activate the photo-catalyst in the photocatalytic coating disposed on the transparent material.

A preparation method of a display panel includes: forming multiple compensation groups on a substrate to obtain an array substrate, where the multiple compensation groups include at least first compensation group and second compensation group, and brightness difference of light-emitting elements of same light-emitting color in the first compensation group and the second compensation group under a same gray scale is larger than a preset value; calculating thicknesses of first color film layer, second color film layer and third color film layer corresponding to each of the multiple compensation groups respectively; forming the first color film layer, the second color film layer and the third color film layer on light-emitting side of the first light-emitting element, the second light-emitting element, and the third light-emitting element respectively according to the thicknesses of the first color film layer, the second color film layer and the third color film layer obtained by calculation.

A light emitting device, includes: a substrate; a light emitting element on the substrate, the light emitting element having a first end portion and a second end portion arranged in a longitudinal direction; one or more partition walls disposed on the substrate, the one or more partition walls being spaced apart from the light emitting element; a first reflection electrode adjacent the first end portion of the light emitting element; a second reflection electrode adjacent the second end portion of the light emitting element; a first contact electrode connected to the first reflection electrode and the first end portion of the light emitting element; an insulating layer on the first contact electrode, the insulating layer having an opening exposing the second end portion of the light emitting element and the second reflection electrode to the outside; and a second contact electrode on the insulating layer.

A light emitting device, includes: a substrate; a light emitting element on the substrate, the light emitting element having a first end portion and a second end portion arranged in a longitudinal direction; one or more partition walls disposed on the substrate, the one or more partition walls being spaced apart from the light emitting element; a first reflection electrode adjacent the first end portion of the light emitting element; a second reflection electrode adjacent the second end portion of the light emitting element; a first contact electrode connected to the first reflection electrode and the first end portion of the light emitting element; an insulating layer on the first contact electrode, the insulating layer having an opening exposing the second end portion of the light emitting element and the second reflection electrode to the outside; and a second contact electrode on the insulating layer.