A light emitting module includes a light emitting diode chip mounted on a first surface of a support substrate, a wavelength conversion member formed on a light emitting surface of the light emitting diode chip, and a reflection member formed to surround a side surface of the wavelength conversion member, an electrode pad formed on a second surface of the support substrate to be electrically connected with the light emitting diode chip, a circuit board formed with a circuit pattern which is electrically connected with the electrode pad, and a conductive bonding material formed between the electrode pad and the circuit pattern to electrically connect the electrode pad and the circuit pattern. Coefficients of thermal expansion of the support substrate, the electrode pad and the conductive bonding material are different, and a coefficient of thermal expansion gradually increases from the support substrate to the circuit board.

Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.

A display device is provided. The display device includes a plurality of pixels disposed in a display area, each of the plurality of pixels includes a first electrode and a second electrode spaced apart from each other in a first direction, and at least one light emitting element disposed between the first electrode and the second electrode and electrically connected to the first electrode and the second electrode, and a distance in the first direction between one end of the light emitting element and one end of the second electrode is greater than a distance in the first direction between another end of the light emitting element and one end of the first electrode.

A light emitting device includes a substrate, a plurality of first light emitting elements mounted on the substrate, including first LED dies, and emitting light having a first wavelength, and a light guide layer arranged so as to cover the plurality of first light emitting elements, and guiding the light from the plurality of first light emitting elements, wherein when LG1 is a distance between the first LED dies, and θc is a critical angle of the light emitted from the light guide layer to the air, and a thickness T between the upper surfaces of the first light emitting elements and the upper surface of the light guide layer is equal to or longer than T1 indicated by T1=LG1/(2tan θc).

An optoelectronic device includes a substrate, an optoelectronic semiconductor component being arranged on the substrate and having a light-emitting surface, preferably on the upper side of the optoelectronic semiconductor component, and a cover being arranged on the substrate for covering the optoelectronic semiconductor component, the cover providing a cavity which surrounds the optoelectronic semiconductor component when the cover is arranged on the substrate, the cover having at least one channel which extends along a first direction in the cover from the outside to the cavity, and the first direction being not parallel to the substrate and preferably extending at least approximately perpendicular to the substrate.

A LED module includes a support including a heat dissipation pad; a circuit board on the support and including contact pads and an electrical connection terminal electrically connected to the contact pads; an LED device including a wiring board having lower and upper surfaces, a lower wiring on the lower surface and facing the heat dissipation pad, an upper wiring on the upper surface and electrically insulated from the lower wiring, contact structures at one side of the upper wiring, an LED chip mounted on another side of the upper wiring, a wavelength conversion film on the LED chip, and a reflective structure covering the upper surface such that a portion of the contact structures and the wavelength conversion film is exposed; a bonding wire electrically connecting the contact pads and the contact structures; and a conductive bump between the heat dissipation pad and the lower wiring.

A display device includes a first barrier wall and a second barrier wall spaced from each other on a substrate; a first electrode on the first barrier wall and extending in a first direction; a second electrode on the second barrier wall and spaced from the first electrode in a second direction, the second electrode extending in the first direction; and light emitting elements between the first and second barrier walls and on the first electrode and the second electrode, wherein the first barrier wall includes a first portion and a second portion that is located further from the second barrier wall than the first portion is, and the second barrier wall includes a third portion opposing the first portion and a fourth portion that is located further from the first barrier wall than the third portion is.

There is provided a production management apparatus including: a memory section configured to memorize component data in which ranks of LED components stored in the stocker are associated with identification information of the LED components; a rank input section configured to accept a rank of the LED component in the LED components of the multiple types as a designated rank, the LED component being used in producing the board product; and a component group generating section configured to generate a component group into which the LED components of the multiple ranks including the designated rank are combined so as to satisfy a required specification of the board product, based on the ranks of the LED components which are included in the component data.

A light emitting device including a housing including walls defining a cavity having one side thereof opened, a light emitter to emit light having a peak wavelength in a blue wavelength band and including first and second light emitting chips, a reflective region in the housing to reflect light, and a wavelength conversion layer disposed on the light emitter and including a first wavelength converter and a second wavelength converter to emit light having different peak wavelengths from each other, in which the first wavelength converter has a first excitation peak wavelength and the second wavelength converter has a second excitation peak wavelength, and the second wavelength converter includes a fluoride-based red phosphor represented by A.sub.2MF.sub.6:Mn.sup.4+, where A is one of Li, Na, K, Ba, Rb, Cs, Mg, Ca, Se, and Zn, and M is one of Ti, Si, Zr, Sn, and Ge.

An electronic device is provided by the present disclosure. The electronic device includes a substrate, a light emitting diode and an optical sensor. The light emitting diode is disposed on the substrate and emits a light. The optical sensor is disposed on the substrate and is configured to receive the light, and the optical sensor receives the light to generate a first electrical signal for fingerprint authentication, and receives the light to generate a second electrical signal for luminance calibration of the light.