A universal substrate for assembling ball grid array (BGA) type integrated circuit packages has a non-conducting matrix, an array of conducting vias extending between top and bottom surfaces of the matrix, and one or more instances of each of two or more different types of fiducial pairs on the top surface of the matrix. Each instance of each different fiducial pair indicates a location of a different via sub-array of the substrate for a different BGA package of a particular package size. The same substrate can be used to assemble BGA packages of different size, thereby avoiding having to design a different substrate for each different BGA package size.

The present disclosure relates to semiconductor structures and, more particularly, to an identification system, method of manufacture and method of use. The structure includes at least one waveguide structure and at least one damaged region positioned in a unique pattern on the at least one waveguide structure.

Implementations of a semiconductor device may include a first die pad having a first metal layer thereon; and a fiducial for aligning to the semiconductor device, the fiducial including a portion including a photodefinable material formed over the first metal layer of the first die pad.

A display panel includes a substrate, a mark structure, a plurality of active elements, and a plurality of light emitting elements. The mark structure is disposed in a mark region of the display panel. The mark structure includes a drilled layer having a plurality of through holes. The active elements are disposed in an active element region of the display panel. Both the mark region and the active element region are located in a display region of the display panel. The light emitting elements are disposed in the display region of the display panel. A first portion in the light emitting elements is overlapped with the mark structure in a normal direction of a surface of the substrate.