An anvil for a wirebonding system may include a stationary substrate having a top working surface; and a first layer fixedly coupled to the top working surface of the stationary substrate for receiving a workpiece, the first layer configured to accommodate a warped surface of the workpiece during a bonding operation.

A die bonding apparatus including a linear motor and a carriage, the carriage including a bond-head configured to pick up a die and a camera configured to detect a target location for positioning the die and for measuring an alignment error between an optical axis of the camera and the target location. A central axis of the bond-head and the optical axis are distant from each other by a first distance. The apparatus includes a linear encoder with an encoder scale, first and second encoder heads mounted on the carriage, and a controller arranged to move the carriage as a function of values read by the first and second encoder heads to align the bonding head with the target location. The first and second encoder heads are distant from each other by a second distance corresponding to the first distance plus an alignment error.

Embodiments herein relate to a method and a correspond CMP processing system for implementing the method. The method includes performing, by a CMP processing system, a CMP process on patterned device structures comprising an interconnect material disposed over a dielectric layer disposed over a substrate, the dielectric layer including interconnect structures etched therein, wherein the interconnect material fills the interconnect structures, and is disposed over the interconnect structures and a field region of the dielectric layer, the CMP process removing portions of the interconnect material disposed on the field region of the dielectric layer and exposing pads within the interconnect structures of the patterned device structures, depositing, by the CMP processing system, a passivation layer over the exposed pads of the patterned device structures, removing, by an integrated hybrid bonding platform, the passivation layer; and bonding, by the integrated hybrid bonding platform, corresponding patterned device structures.

This product holding device comprises: a stage (32) on which a product is to be placed; and vibration elements (38) that apply ultrasonic vibrations to the product (100) placed on the stage (32), and causes falling foreign matter (110) to float at a location away from the surface of the product (100). In addition, the product holding device (30) further comprises: a transport mechanism (42) that transports the floating foreign matter (110) to a location that is outside the product (100) in a plan view; and a collection mechanism (50) that collects the transported foreign matter (110).

The present invention relates to an apparatus and method for wafer oxide removal and reflow treatment. In particular, the present invention relates to an apparatus for wafer oxide removal and reflow treatment, comprising: a heating plate, a sample plate for supporting a wafer sample above the heating plate, and an electron attachment pin plate above the sample plate, wherein the heating plate is configured to be capable of moving up and down, and contacting and heating the sample plate.

In an implementation, a method can include creating a first edge in a workpiece that includes a die and a dicing lane adjacent to the die, wherein the first edge extends to at least the dicing lane. The method can further include dicing the workpiece to separate the die from a remainder of the workpiece, wherein dicing forms an outer peripheral edge and is performed after creating the first edge, and bonding the die to a bonding site, wherein, during bonding, the outer peripheral edge does not contact an object. In another implementation, the bonding substrate can comprise a trench, and the die may or may not have an edge. In both methods, outer peripheral edges of the die may not contact any object during a bonding transfer cycle. A bonding apparatus can be adapted to carry out the method.

Some devices, systems, and methods control a plurality of actuators to move a chiplet chuck holding a chiplet toward a substrate while maintaining a set tip-tilt of the chiplet chuck; detect contact of the chiplet with the substrate based on a change of a force applied to the chiplet chuck by at least one actuator of the plurality of actuators while maintaining the set tip-tilt of the chiplet chuck; and, after detecting the contact of the chiplet with the substrate, control the plurality of actuators to move the chiplet chuck toward the substrate without maintaining the set tip-tilt of the chiplet chuck and adjusting a respective force that each actuator of the plurality of actuators applies to the chiplet chuck such that a predetermined condition is satisfied.

An integrated circuit component package apparatus includes a plurality of feeding rails, and a plurality of workstations. The feeding rails define a transporting route thereon, and are for transporting a component carriage boat carrying an integrated circuit component along the transporting route. The plurality of workstations are sequentially arranged along the transporting route, and include a thermal interface material application station, an adhesive coating station, a lid placement station, and a lid bonding station. The thermal interface material application station is for applying a thermal interface material on the integrated circuit component. The adhesive coating station is for applying an adhesive on the integrated circuit component. The lid placement station is for placing a lid on the integrated circuit component. The lid bonding station is for bonding the lid onto the integrated circuit component.

An apparatus for bonding multiple pluralities of chiplets to a destination substrate includes one or more bonding heads, each bonding head of the one or more bonding heads having a curved surface configured to hold a plurality of chiplets, a destination stage configured to hold the destination substrate, and a controller configured to operate the movement of the one or more bonding heads and the destination stage. The controller includes a plurality of motors configured to drive each bonding head of the one or more bonding heads in at least in the X, Y, and Z, directions. The curved surface is a convex surface having a curvature bulging towards the destination stage.