The present invention provides systems, and methods for manufacturing polarized light emitting semiconductor packages, comprising the disposition of a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits linearly polarized light in a first directionality. A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package. A second bonding solution is disposed about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality, and a second energy is applied to polymerize the second bonding solution, thereby encapsulating the second polarizing element and the second light emitting element in a second semiconductor package.

A ceramic wavelength converter assembly may include two first layers having an undoped host material or a doped host material, two second layers having a barrier material and being disposed between the two first layers, and a third layer having an undoped host material or a doped host material and being disposed between the two second layers. The two first layers may include the undoped host material and the third layer may include the doped host material, or the two first layers may include the doped host material and the third layer may include the undoped host material. At least one of the two first layers may have a patterned structure.

Provided is a semiconductor nanoparticle complex composition and the like in which a semiconductor nanoparticle complex is dispersed at a high concentration and which has high fluorescence quantum yield. A semiconductor nanoparticle complex composition in which a semiconductor nanoparticle complex is dispersed in a dispersion medium, wherein: the semiconductor nanoparticle complex has a semiconductor nanoparticle and a ligand coordinated to the surface of the semiconductor nanoparticle; the ligand includes an organic group; the dispersion medium is a monomer or a prepolymer; the semiconductor nanoparticle complex composition further includes a crosslinking agent; and a mass fraction of the semiconductor nanoparticle in the semiconductor nanoparticle complex composition is 30% by mass or more.

A light-emitting device includes: a substrate having a first surface; one or more light-emitting elements disposed on the first surface of the substrate; and a first reflective member disposed on the first surface of the substrate and surrounding the light-emitting elements, the first reflective member including: a first resin, and a plurality of first hollow particles in the first resin. The first reflective member has an uneven surface formed with the first hollow particles. A surface roughness Ra of the first reflective member is 0.10 .Math.m or more and 3.0 .Math.m or less, and a reflectance of the first reflective member is 40% or more.

Multiple-junction light-emitting diodes (LEDs), and more particularly lumiphoric material arrangements for multiple-junction LEDs are disclosed. LEDs may refer to multiple-junction LED chips and/or LED packages that include multiple-junction LED chips. Individual lumiphoric material regions may be arranged in positions that are registered with individual junctions of a multiple-junction LED chip. The lumiphoric material regions may be formed at the LED chip level and/or at the LED package level. Different ones of the lumiphoric material regions may be configured to provide different wavelengths in response to recipient light emitted by junctions of the LED chip. In this manner, a single multiple-junction LED chip according to the present disclosure may be capable of providing a plurality of different emission colors and/or wavelengths.

A light-emitting device 100 includes: a light-emitting element; a light-transmissive member covering the light-emitting element; and a light-diffusing agent contained in the light-transmissive member and comprising hollow particles. The light-transmissive member has a first surface having irregularities according to the light-diffusing agent. The first surface of the light-transmissive member has a convex shape with a height gradually increased from a peripheral portion of the first surface toward a central portion of the first surface.

A display including a backlight unit including a circuit board, light emitting devices arranged on the circuit board, and a combined optical sheet disposed on the light emitting devices, and a display panel disposed on the backlight unit, in which each light emitting device includes a light emitting diode chip, a light transmitting resin covering an upper surface and a side surface of the light emitting diode chip, and a light blocking member covering an upper surface of the light transmitting resin, and the light emitting devices are mounted on the circuit board to be driven independently driven.

A display device includes a first substrate having a flexibility, a thin film transistor layer disposed on the first substrate, where the thin film transistor layer includes a thin film transistor, a first circuit board disposed under the first substrate, and a second circuit board electrically connecting the first circuit board and the thin film transistor to each other. A portion of the second circuit board is disposed between the first substrate and the thin film transistor layer.

A method includes depositing a layer comprising a photoinitiator and a curable material onto a surface and applying a nanoimprint mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities. After applying the nanoimprint mold, the mesh is illuminated with light causing decarboxylation of the photoinitiator to initiate curing of the curable material. After curing the curable material, the nanoimprint mold is removed and a wavelength converting material is deposited in the cavities to form an array of wavelength converting pixels.

A light emitting device includes a light emitting diode configured to emit blue or ultraviolet radiation incident photons, a color conversion material located over the light emitting diode and configured to absorb the incident photons emitted by the light emitting diode and to generate converted photons having a longer peak wavelength than a peak wavelength of the incident photons, and at least one light extracting feature located between the light emitting diode and the color conversion material.