A method for manufacturing a light-emitting element includes: providing a structure body including: a semiconductor structure body having a first surface, a second surface located on a side opposite to the first surface, and a lateral surface that connects the first surface and the second surface, a first insulating film covering the lateral surface of the semiconductor structure body, a second insulation film covering the first surface of the semiconductor structure body and an upper surface of the first insulating film on a first surface side, and a substrate facing the second surface of the semiconductor structure body; forming a mask on a part of the second insulating film located above the first surface of the semiconductor structure body; and removing a part of the second insulating film located around the mask in a top view and exposed from the mask.

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

A display apparatus including a frame, light emitting diode chips separated from each other and regularly arranged in a matrix on the frame, an optical part including a display panel and at least one of a phosphor sheet and an optical sheet, a light guide plate disposed between the frame and the optical part to cover the light emitting diode chips, at least one reflector disposed between the frame and the light guide plate to reflect at least part of light emitted from the light emitting diode chip to direct at least part of light emitted therefrom to the light guide plate, and a first-type electrode and a second-type electrode, in which at least one of the light emitting diode chips is a flip-chip type and includes a first-type semiconductor layer electrically connected to the first-type electrode and a second-type semiconductor layer electrically connected to the second-type electrode.

A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.

There is provided a light emitting diode, LED, filament lamp (100) which has a longitudinal axis (LA) and provides LED filament lamp light (101). The LED filament lamp (100) comprises a LED filament (102) which comprises a light transmissive, elongated substrate (103). Said substrate (103) has a first main surface (105) at a first side (105) and a second main surface (106) at a second side (106′) opposite to the first side (105′). A plurality of LEDs (104) is mounted only onto said first main surface (105) and configured to emit LED light (107). An encapsulant (108, 114) covers the plurality of LEDs (104) and at least part of said first main surface (105). The LED filament (102) by a specific distribution of beam modifying material (115′, 115″, 109′, 109″) comprises at least a luminescent material (109′, 109″) provided in the encapsulant, and is configured to emit first LED filament light (112) in a first main direction (D1) away from the first main surface (105) and having a first color point x1,y1, and to emit second LED filament light (113) in a second main direction (D2) away from the second main surface (106) having a second color point x2,y2. The first main direction (D1) is opposite to the second main direction (D2), and, wherein (i) |x1-x2|≥0.05 and/or (ii) |y1-y2|≥0.05 applies.

A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles. The second light-transmissive layer contains a third matrix and second diffusive particles.

A method of manufacturing a light emitting element includes: providing a first light emitting part and a second light emitting part, the first light emitting part comprising a first base member and a first semiconductor layered body, the second light emitting part comprising a second base member and a second semiconductor layered body; bonding the first and second light emitting parts to each other such that the first base member and the second base member are disposed between the first semiconductor layered body and the second semiconductor layered body; disposing a light reflecting member to cover the bonded first and second light emitting parts; removing a portion of the light reflecting member to expose surfaces of the first and second base members; and disposing a wavelength conversion member on the exposed surface of the first base member and the exposed surface of the second base member.

The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.

An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) has at least one side face (31) which extends at least in places at an angle β of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.