There is herein described a low power consumption high brightness display. More particularly, there is described an integrated LED micro-display and a method of manufacturing the integrated LED micro-display.

A wavelength conversion member, comprises: a substrate; a first wavelength conversion layer on the substrate, the first wavelength conversion layer containing a first phosphor and a first matrix; and a second wavelength conversion layer containing a second phosphor, first inorganic particles, and a second matrix. The first phosphor and the second phosphor convert at least part of the excitation light incident on the second main surface into first light having longer wavelengths than the excitation light. The first light is emitted from the second main surface of the second wavelength conversion layer. A volume Vp1 of the first phosphor, a volume Vw1 of the first wavelength conversion layer, a volume Vp2 of the second phosphor, and a volume Vw2 of the second wavelength conversion layer satisfy Vp1/Vw1>Vp2/Vw2.

A micro-light emitting diode (micro-LED) including a substrate, a mesa structure including a plurality of semiconductor layers formed on the substrate, and an insulation material layer on sidewalls of the mesa structure. The mesa structure includes a light emitting region configured to emit light of a first wavelength. The insulation material layer includes a transparent insulating material and metal nanoparticles immersed in the transparent insulating material. The transparent insulating material and the metal nanoparticles are configured to cause plasmonic scattering of the light of the first wavelength back into the mesa structure, such that the light of the first wavelength may be randomized in the mesa structure, thereby improving the light extraction efficiency and external quantum efficiency of the micro-LED.

A display device includes pixels; a substrate; a first electrode and a second electrode disposed in each of the pixels and spaced apart from each other on a substrate; light-emitting elements disposed between the first electrode and the second electrode; a wavelength control layer disposed on the light-emitting elements; and a light-transmitting layer disposed between the light-emitting elements and the wavelength control layer, wherein the light-transmitting layer disposed in each of the pixels is spaced apart from the light-transmitting layer disposed in an adjacent one of the plurality of pixels.

A light emitting apparatus includes: a mount substrate; a first light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the first light emitting device via an adhesive material, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the first light emitting device, and wherein a first lateral surface of the light transparent member is located laterally inward of a lateral surface of the first light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.

A display device includes a pixel including a first sub-pixel configured to emit a first color light and a second sub-pixel configured to emit a second color light that is different from the first color light. The display includes a substrate including an emission area and a non-emission area surrounding the emission area, a bank in the non-emission area on the substrate, a first electrode and a second electrode in each of the first sub-pixel and the second sub-pixel on the substrate, a light emitting element between the first electrode and the second electrode in the emission area, a wavelength conversion layer on the light emitting element in the emission area, and a protection layer on the substrate. The protection layer includes a first area in the emission area and located between the wavelength conversion layer and the light emitting element, and a second area in the non-emission area.

A lighting device is disclosed that includes a plurality of light emitting diodes arranged in an array, trenches disposed between the light emitting diodes, and a scattering layer disposed in the trenches, the scattering layer including a binder matrix, a plurality of scattering particles disposed in the binder matrix, and a plurality of porous particles containing a gas, the porous particles disposed in the binder matrix.

A semiconductor element package includes: a semiconductor element arranged above a first substrate; first and second electrodes arranged above the first substrate and electrically connected to the semiconductor element; a housing which is arranged above the first substrate and arranged around the semiconductor element, and which has a stepped portion in the upper area thereof; a diffusion part arranged on the stepped portion of the housing and arranged above the semiconductor element; and a plurality of via holes penetrating the first substrate and the housing.

An LED element capable of further improving the light extraction efficiency and its manufacturing method are provided. An LED element comprises a semiconductor lamination part that includes a light-emitting layer, a diffractive surface on which light emitted from the light-emitting layer is incident and on which projection parts are formed with a period larger than an optical wavelength of the light and smaller than a coherence length of the light and which reflects the incident light in a plurality of modes according to a Bragg diffraction condition and transmits the incident light in a plurality of modes according to the Bragg diffraction condition, and a reflecting surface that reflects light refracted by the diffractive surface so that the reflected light is incident on the diffractive surface again, wherein the semiconductor lamination part is formed on the diffractive surface without any void around the projection parts and a proportion of a flat part in the diffractive surface is 40% or more in a plan view thereof.

The light emitting device package disclosed in an embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting device disposed on the first and second frames, wherein the first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, wherein the first end portion includes a first protruding portion protruding toward the second frame, and the second end portion includes a second protruding portion protruding toward the first frame. The light emitting device may include a first bonding portion disposed on the first protruding portion and a second bonding portion disposed on the second protruding portion.