A lighting device contains light-emitting elements and has an elongated shape. The lighting device has a housing that has reflective side walls extending in a longitudinal direction of the housing; a cavity formed between the reflective side walls; and light-emitting elements arranged at least partially along the longitudinal direction relative to each other in the cavity. An opening of the cavity forms a light-emitting area, A width of the cavity expands from the light-emitting elements towards the opening at least in sections. A reflective element covers at least a section of the opening and reflects a part of light emitted from the light-emitting elements towards the cavity and reduces a width of the light-emitting area compared to a width of the opening.

An LED light-emission device includes a substrate, an LED chip, a phosphor-containing resin containing a phosphor and covering the LED chip, and a diffusing agent-containing resin containing a diffusing agent that diffuses light emitted from the phosphor-containing resin and sealing the phosphor-containing resin. The LED chip, the phosphor-containing resin, and the diffusing agent-containing resin are placed on a same flat face of the substrate.

The method for manufacturing a light-emitting device includes flip-chip mounting a first light-emitting element and a second light-emitting element on a substrate separately from each other, bonding a first light-transmissive member to the first light-emitting element, the first light-transmissive member having a first lateral surface, and bonding a second light-transmissive member to the second light-emitting element, the second light-transmissive member having a second lateral surface, with the second lateral surface being separated from and facing the first lateral surface, scraping at least one of the first lateral surface and the second lateral surface to expose at least one of a modified first lateral surface and a modified second lateral surface, forming a light-reflective covering member on the substrate to cover the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface, and cutting the substrate and the covering member between the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface.

A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.

A display apparatus includes a substrate, a light-emitting diode (“LED”) provided above the substrate, an insulating layer provided above the LED, and a wire grid polarizer (“WGP”) provided above the insulating layer.

The present invention provides a light-emitting diode (LED) device and a method for manufacturing the same. The LED device comprises: a substrate (1); a chip (2) disposed on the substrate (1); and a first lens (3) disposed on the substrate (1) and spaced from the chip (2); wherein the first lens (3) comprises luminescent powder (7) and at least one of light-diffusing particles (8) and light-reflecting particles (10). The LED device provided by the present invention has a high luminous efficiency, and solves the problem in the prior art that the LED device has a small angle of emergence and the emergent light emergence lacks of uniformity.

A color conversion film is provided. The film includes at least one narrow band emission phosphor dispersed within a binder matrix, wherein the narrow band emission phosphor has a D50 particle size from about 0.1 μm to about 15 μm and is selected from the group consisting of a green-emitting U.sup.6+-containing phosphor, a green-emitting Mn.sup.2+-containing phosphor, a red-emitting phosphor based on complex fluoride materials activated by Mn.sup.4+, and a mixture thereof. A device is also provided.

The disclosed light emitting device includes an intermediate layer interposed between the light emitting semiconductor structure and the substrate. The light emitting semiconductor structure includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, wherein the active layer has a multi quantum well structure including at least one period of a pair structure of a quantum barrier layer including Al.sub.xGa.sub.(1-x)N (0<x<1) and a quantum well layer including Al.sub.yGa.sub.(1-y)N (0<x<y<1), and at least one of the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer includes AlGaN. The intermediate layer includes AlN and has a plurality of air voids formed in the AlN. At least some of the air voids are irregularly aligned and the number of the air voids is 10.sup.7 to 10.sup.10/cm.sup.2.

Incident optical signals propagate within a diffuser substrate and impinge upon an optical diffuser within the diffuser substrate or on its output surface. The optical diffuser redirects or transforms respective portions of each incident signal into corresponding forward- and backward-directed optical signals. The backward-directed signals are redirected or transformed into additional incident signals, and so on. The forward-directed optical signals collectively form the optical output of an illumination source that exhibits reduced speckle. The illumination source can include multiple laser sources formed on or attached to an input surface of the diffuser substrate.

A UV LED package and an LED module including the same. The UV LED package includes an upper semiconductor layer; a mesa disposed under the upper semiconductor layer, having an inclined side surface, and comprising an active layer and a lower semiconductor layer; a first insulation layer covering the mesa and having an opening exposing the upper semiconductor layer; a first contact layer contacting the upper semiconductor layer through the opening of the first insulation layer; a second contact layer formed between the mesa and the first insulation layer and contacting the lower semiconductor layer; a first electrode pad and a second electrode pad disposed under the first contact layer and electrically connected to the first contact layer and second contact layer, respectively; and a second insulation layer located between the first contact layer and the first and second electrode pads, wherein the active layer emits UV light having a wavelength of 405 nm or less. With this structure, the LED package has high efficiency and high heat dissipation characteristics.