A surface shielding assembly for LED packaging, including: an LED luminescent module (1), a sealing member (2), and a reflective layer (3). The LED luminescent module (1) is encapsulated within the sealing member (2). The sealing member (2) has a plurality of light emergent surfaces. A reflective layer (3) is at least arranged on a light emergent surface facing the LED luminescent module (1). The reflective layer (3) is capable of partially or totally reflecting light rays emitting from the LED luminescent module (1) to other light emergent surfaces. By arranging the reflective layer (3) in a direction facing the LED luminescent module (1), the light emitted from the LED luminescent module is emergent from other light emergent surfaces at lateral sides, in this way, the light intensity and the overall light-emitting angle of the lateral sides of the LED lamp are increased, thereby changing the over-bright light spot caused by the excessive light intensity at the front side in the prior art, reducing the intensity of the central light, and achieving the effect of improving the uniformity of the light spot.

Disclosed are various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

A light emitting structure includes a packaged back-emitting light emitting device mounted on a reflective substrate. The properties of the reflective surface may be controlled to provide a desired luminance pattern. In this manner, the creation of a light emitting structure that provides a desired luminance pattern may be independent of the provider of the packaged light emitting device.

Provided are a light emitting device and a method of fabricating the same. The light emitting device includes: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer and including a first surface and a second surface; first and second contact electrodes each ohmic-contacting the first and second conductivity type semiconductor layers; and first and second electrodes disposed on the first surface of the light emitting structure, in which the first and second electrodes each include sintered metal particles and the first and second electrodes each include inclined sides of which the tangential gradients with respect to sides of vertical cross sections thereof are changing.

A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 4×10.sup.−5/K and at most 8×10.sup.−5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30° C. and at most 50° C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 μm and at most 15 μm.

The present disclosure provides a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer on the substrate; a first window layer comprising a first semiconductor optical layer on the intermediate layer and a second semiconductor optical layer on the first semiconductor optical layer; and a light-emitting stack on the second semiconductor optical layer; wherein a difference between the lattice constant of the intermediate layer and the lattice constant of the first semiconductor optical layer is greater than 2.3 Å.

A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material and filler particles, wherein the filler particles include an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.

The method of manufacturing a light emitting device includes: providing a light-transmissive member; providing light emitting elements each having a primary light emission surface and an electrode formation surface; bonding the light emitting elements to a base member such that the electrode formation surfaces face an upper surface of the base member; disposing a generally flat layer of a light-transmissive bonding member on an upper surface of the light-transmissive member; disposing the light emitting elements on the light-transmissive member such that the primary light emission surfaces face the upper surface of the light-transmissive member via the bonding member; disposing a part of the bonding member on a lateral surface of each of the light emitting elements; removing a part of the light-transmissive member to form a groove between the light emitting elements; forming a light-reflective member at least in the groove; and cutting the light-reflective member.

A light emitting device includes a first light emitting element having a top face and a bottom face which faces the base, and a second light emitting element. A wavelength conversion member is provided on the top face and includes a light transmitting part made of an inorganic material and a phosphor layer. The light transmitting part has an upper face and a lower face. A phosphor layer is disposed between the lower face and the top face. The phosphor layer is bonded to the top face of the first light emitting element. The reflecting member covers the lateral faces of the phosphor layer. A light transmissive sealing resin is disposed on the base between the first and second light emitting elements and between the wavelength conversion member and the second light emitting element. The light transmissive sealing resin covers the lateral faces via the reflecting member.

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.