In an embodiment a granular cover and/or filling material includes a plurality of particles, wherein each particle consists of a matrix material in which at least one filler particle is incorporated, and wherein each filler particle comprises titanium dioxide and a coating material.

A display includes a display panel and a backlight. The backlight includes an excitation source that generates blue excitation light with a dominant emission wavelength in a range 445 nm to 465 nm; and a wavelength converting film located remotely to the excitation source and between the excitation source and display panel. The wavelength converting film, in terms of photoluminescence material, includes a manganese-activated fluoride phosphor and a europium activated sulfide phosphor; where the manganese-activated fluoride phosphor receives at least a portion of the blue excitation light and in response emits red light with a peak emission wavelength in a range 610 nm to 650 nm; and where the europium activated sulfide phosphor receives at least a portion of the blue excitation light and in response emits green light having a peak emission wavelength in a range 525 nm to 545 nm; and where the europium activated sulfide phosphor is coated with at least one oxide material.

A display device including: a display unit including a plurality of emission areas which emit light; and a plurality of touch electrodes disposed on the display unit to detect a touch input, wherein at least some of the touch electrodes include a code pattern part including a plurality of code patterns that include cutouts corresponding to location inforniation.

In accordance with one or more aspects of the present disclosure, a semiconductor device is provided. The semiconductor device may include: a plurality of light-emitting devices comprising a first light-emitting device, a second light-emitting device, and a third light-emitting device, wherein each of the plurality of light-emitting devices comprises a first ohmic contact and a second ohmic contact; and a light-conversion device with embedded quantum dots, wherein a first portion of the light-conversion device includes a first plurality of quantum dots for converting light produced by the first light-emitting device into light of a first color, wherein a second portion of the light-conversion device includes a second plurality of quantum dots for converting light produced by the second light-emitting device into light of a second color, and wherein the third light-emitting device emits light of a third color.

A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.

A light source module includes a substrate, a light emitting device, a package structure, and an optical pattern. The light emitting device and the package structure are disposed on a surface of the substrate, and the package structure covers the light emitting device. The package structure has a first groove and a second groove connected to each other. The light emitting device is located between the first grove and the substrate. The second groove is located between the first groove and the substrate. An orthogonal projection of the region occupied by the first groove on the substrate has a geometric center. The light emitting device is located at the geometric center. An orthogonal projection of the region occupied by the second groove on the substrate does not overlap the geometric center. The optical pattern is disposed in the first groove and the second groove, and is transflective.

A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

A light emitting device includes a mounting board, light sources, a light diffuser, a wavelength conversion layer, and scatter reflection portions. Each of the light sources has an upper face on which a light reflecting layer is disposed. The light diffuser is arranged above the plurality of light sources. The wavelength conversion layer is located at least between the light sources and the light diffuser. The wavelength conversion layer is configured to absorb at least a portion of light from the light sources and to emit light having a wavelength which is different from a wavelength of the light from the light sources. The scatter reflection portions are arranged on a surface of the wavelength conversion layer that is closer to the light diffuser. Each of the scatter reflection portions is arranged above at least a portion of the upper face of a corresponding one of the light sources.

A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

An apparatus can include a lens that can shape light emerging from a light emitting diode (LED). The emergent light from the LED can be substantially centered around an LED axis. An incident surface of the lens can be positioned to face the LED. The incident surface can include a concave portion. The concave portion can be substantially smooth, so as not to substantially scatter light that strikes the concave portion. The concave portion can be substantially centered around a concave portion axis that is non-coaxial with the LED axis. The incident surface can include a scattering portion, positioned away from the concave portion, which can be textured so as to scatter light that strikes the scattering portion. An exiting surface of the lens can optionally include a generally planar portion that at least partially surrounds a substantially smooth convex portion.