The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.

A light emitting device includes a circuit substrate, a plurality of light emitting elements, a control element, and a sealing structure. The circuit substrate has a plurality of upper electrical connecting pads at the top thereof and a plurality of testing pads and a plurality of lower electrical connecting pads at the bottom thereof. The light emitting elements are arranged on the circuit substrate. The control element is arranged on the circuit substrate and electrically connected to the light emitting elements. The sealing structure is configured to cover the light emitting elements and the control element, and the testing pads of the circuit substrate are exposed from the sealing structure for testing respective characteristic parameter values of the light emitting elements.

A light emitting device comprising: a light emitting element; a phosphor layer covering side surfaces and an upper surface of the light emitting element; a first light diffusion layer disposed lateral to the light emitting element with the phosphor layer interposed therebetween; a second light diffusion layer disposed on the phosphor layer and the first light diffusion layer; and a first light reflective layer disposed on the second light diffusion layer. A lower surface of the second light diffusion layer comprises a first lower surface portion facing an upper surface of the phosphor layer and a second lower surface portion facing an upper surface of the first light diffusion layer, and at least a part of the first lower surface portion is located lower than the second lower surface portion.

The invention relates to a light emitting device (LED), especially a LED at least partly embedded in transparent or translucent silicone fill, whereby the embedded LED is housed in a white silicone housing. Here and in the following, the wording transparent silicone fill always means a transparent or translucent silicone material. The invention further relates to a method for embedding the LED partly in a white silicone housing on the one hand and partly in transparent silicone fill on the other hand. The invention finally relates to the transparent silicone fill. The inner part of the LED device is at least partly embedded in transparent silicone fill, wherein the at least partly embedded LED device is housed in a white silicone housing comprising a white box silicone. A part of the inner part of the LED device is embedded in the white box silicone.

A light-emitting device of the present disclosure includes: a solid-state light source emitting excitation light; a phosphor layer having a first refractive index, provided on a light-emitting surface side of the solid-state light source, and having a first reflection film on its side surface; a low refractive layer provided on the phosphor layer and having a second refractive index less than the first refractive index; and a sealing member encapsulating the phosphor layer and the low refractive layer and having a third refractive index greater than or equal to the second refractive index.

To extract light from a light-emitting diode (and thereby improve efficiency of the display), a microlens stack may be formed over the light-emitting diode. The microlens stack may include an array of microlenses that is covered by an additional single microlens. Having stacked microlenses in this way increases lens power without increasing the thickness of the display. The array of microlenses may be formed from an inorganic material whereas the additional single microlens may be formed from an organic material. The additional single microlens may conform to the upper surfaces of the array of microlenses. An additional low-index layer may be interposed between the light-emitting diode and the array of microlenses. A diffusive layer may be formed around the light-emitting diode to capture light emitted from the light-emitting diode sidewalls.

A light source module includes a circuit substrate, a plurality of light emitting units, a plurality of microstructures and a wavelength converting layer. The circuit substrate includes a first surface and has a recessed portion recessed inwardly from the first surface. The circuit substrate forms a bottom and a sidewall in the recessed portion. The light emitting units are disposed on the bottom and located in the recessed portion. The microstructures are disposed on at least one of the bottom and the sidewall. The wavelength converting unit covers the light emitting units, and fills the recessed portion.

A light emitting device is disclosed. In an embodiment a light-emitting device includes a plurality of light-emitting diode chips arranged on a mounting surface of a carrier, a first translucent element and a second translucent element, wherein the first translucent element is arranged over the plurality of light-emitting diode chips as viewed from the mounting surface and the second translucent element is disposed on a side of the plurality of light-emitting diode chips opposite the first translucent element such that the light-emitting diode chips are arranged between the first and second translucent elements, wherein the first and second translucent elements are configured to emit light generated by the light-emitting diode chips during operation outwardly, and wherein the first and second translucent elements appear white or grey in daylight.

A backlight includes: a light-emitting module including: a base member including a conductive pattern; a plurality of light-emitting devices, each of which is flip-chip bonded on the base member and electrically connected to the conductive pattern, and each of which includes: a light-emitting element, and a dielectric multi-layer film located on an upper surface of the light-emitting element; a plurality of light reflective members arranged between the plurality of light-emitting elements; a transparent laminate located above the plurality of light-emitting devices and including: a wavelength converting member adapted to absorb a portion of light from the light-emitting elements and to emit light of a wavelength that is different from an emission wavelength of the light-emitting elements, and a diffuser plate; and a reflective member facing a lateral surface of the transparent laminate.

A surface roughening method includes the following steps: preparing a first epitaxial layer of a three-dimensional island shape growth over a light emitting structure; and preparing a discontinuous second epitaxial layer over the first epitaxial layer. The surface roughening method provided in the present application is simple and convenient, and improves the efficiency. In addition to the epitaxial growth process, it is not necessary to use an additional process such as wet etching, photonic crystal and other processes to further process the surface of the epitaxial layer, and the method may be implemented by means of one process in a same reaction equipment.