H01L2933/0091

White Light Emitting Device with Dimming Control
20210384387 · 2021-12-09 ·

A white light emitting device may include a substrate, first LEDs disposed on the substrate, a first photoluminescence material disposed over the first LEDs, second LEDs disposed on the substrate, where the first LEDs and the second LEDs emit blue light at substantially the same wavelength, a second photoluminescence material disposed over the second LEDs, the second photoluminescence material having a composition different from the first photoluminescence material, where an emission product of the white light emitting device is a combination of light emitted from (i) a combination of the first LEDs and the first photoluminescence material, and (ii) a combination of the second LEDs and the second photoluminescence material, and a dimming control connected to the first LEDs and to the second LEDs; where the dimming control is actuable to modify the emission product.

DISPLAY PANEL

A display panel including a substrate, a light-emitting device, a light-shielding layer, and a light-guide pillar is provided. The light-emitting device is disposed on the substrate. The light-shielding layer is disposed on the substrate and has a sidewall surrounding an opening. The light-guide pillar is disposed between the substrate and the light-emitting device and located in the opening. A gap exists between the light-guide pillar and the sidewall of the light-shielding layer.

Semiconductor Light Source Device of Optical Integrated Packaging

The present application relates to the technical field of optical integrated devices, and specifically discloses a semiconductor light source device of optical integrated packaging with high light extraction efficiency and low device heat generation. The semiconductor light source device of optical integrated packaging comprises a substrate, an optical lens, a LED chip and a light transmitting glue layer, the substrate is provided with a circuit, and the optical lens is fixedly connected with the substrate; a light source cavity is provided between the optical lens and the substrate; the LED chip and the light transmitting glue layer are respectively accommodated in the light source cavity; the LED chip is arranged on top of the circuit and electrically connected with the circuit; the light transmitting glue layer is at least arranged on an upper surface of the LED chip; the light transmitting glue layer is used to reduce Fresnel loss when the light of the LED chip is taken out; an outer surface of the light transmitting glue layer is a convex surface, and the convex surface is used to reduce a total reflection loss of a light emitted by the LED chip.

QUANTUM DOT INK, MANUFACTURING METHOD OF FULL-COLOR FILM, AND DISPLAY PANEL

A quantum dot ink, a manufacturing method of a full-color film, and a display panel are provided. The quantum dot ink includes a plurality of quantum dots, a plurality of scattering particles, a polar solvent, and a transparent polymer material, wherein the transparent polymer material is used as a host material.

Flexible and cuttable LED sheet
11193635 · 2021-12-07 · ·

LED lighting sheets feature foldable light-sheets including multiple illumination modules electrically interconnected such that unremoved illumination units remain energized upon removal of one or more by horizontal, vertical and or diagonal cuts. A new and non-obvious conductor geometry forms a 3D mesh that is resistant to cutting from any direction in 45 degree increments. Relatively constant illumination levels are maintained in the remaining LEE's by using relatively high resistance series connected current limiting resistors for each LEE. Each current limiting resistor may be, for example, ten times the resistance of the entire lower ribbon conductive layer. Tunable color LEE's are included.

Colour micro-LED display apparatus

A colour micro-LED display apparatus comprises an array of reflective optical elements and an array of micro-LED pixels with a uniform emission colour across the array arranged between the array of reflective optical elements and an output substrate. Light from the micro-LEDs is directed into the reflective optical elements and is incident on scattering regions in the apparatus. Colour converted scattered light is transmitted by the output substrate. A thin and efficient display apparatus may be provided with high spatial and angular colour uniformity and long lifetime.

LIGHT-EMITTING COMPONENT AND DISPLAY APPARATUS
20210373383 · 2021-12-02 ·

The present application discloses a light-emitting component and a display apparatus. The light-emitting component includes a first diffusion layer, a first prism sheet disposed below the first diffusion layer; a second prism sheet disposed below the first prism sheet; a second diffusion layer disposed below the second prism sheet; a flexible substrate disposed below the second diffusion layer; a second substrate attached to the flexible substrate; an emission layer disposed between the second diffusion layer and the flexible substrate; the emission layer is integrated on the flexible substrate; the emission layer includes a photoluminescence layer and an electroluminescent layer; the photoluminescence layer is disposed between the second diffusion layer and the flexible substrate; and the electroluminescent layer is disposed between the photoluminescence layer and the flexible substrate.

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a support substrate, a driving layer provided on the support substrate and including a driving element configured to apply power to a pixel electrode, and a light-emitting layer provided on the driving layer.

Optoelectronic Component, Method for Producing an Optoelectronic Component and Lighting Device

In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.

DISPLAY DEVICE

A display device includes a substrate; a first electrode and a second electrode arranged to be spaced apart from each other on the substrate; a first insulating layer on the substrate; a light emitting element on the first insulating layer, located between the first electrode and the second electrode, and including a first end portion and a second end portion; a third electrode on the substrate and electrically connected to the first electrode and the first end portion; a fourth electrode on the substrate and electrically connected to the second electrode and the second end portion; a second insulating layer on the substrate and covering the light emitting element, the third electrode, and the fourth electrode; and a light diffusion layer on the second insulating layer and including a light diffusion particle.