Patent classifications
H01L2933/0091
SEMICONDUCTOR NANOPARTICLES, ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR NANOPARTICLES
An electronic device includes a semiconductor nanoparticle, and a method of manufacturing the semiconductor nanoparticle is additionally provided. The semiconductor nanoparticle includes: a core including a first element; and a shell covering at least a portion of a surface of the core and including a second element and a third element, wherein the first element, the second element, and the third element are different from each other, and the first element and the second element are chemically bonded to each other on the at least a portion of the surface of the core.
DISPLAY DEVICE
A display device is provided. The display device includes a first substrate, a first electrode and a second electrode on the first substrate and spaced apart from each other, a first insulating layer on the first electrode and the second electrode, light-emitting elements on the first insulating layer and having ends on the first electrode and the second electrode, respectively, and a second insulating layer on the first insulating layer and the light-emitting elements, and defining openings exposing the ends of the light-emitting elements, wherein the second insulating layer is configured to transmit light in a wavelength range of light emitted by the light-emitting elements, and configured to block transmission of light outside of the wavelength range.
DISPLAY PANEL AND PRODUCTION METHOD THEREOF
A display panel including a wavelength conversion structure that includes a base structure including partition walls that define a first space and a second space, a first quantum dot composite disposed in the first space, and a second quantum dot composite disposed in the second space. The height of the partition wall is greater than or equal to about 5 micrometers and less than or equal to about 50 micrometers, and the first quantum dot composite provides a first top surface and the second quantum dot composite provides a second top surface. A production method for making the wavelength conversion structure uses a first ink composition that includes first quantum dots and a first matrix, and a second ink composition that includes second quantum dots and a second matrix.
LIGHT-EMITTING DIODE PACKAGES WITH SELECTIVELY PLACED LIGHT-ALTERING MATERIALS AND RELATED METHODS
Light-emitting diode (LED) packages and more particularly LED packages with selectively placed light-altering materials and related methods are disclosed. Selectively placed light-altering materials are provided that are arranged along peripheral edges of LED chips and along portions of underlying submounts. By covering peripheral edges of LED chips without covering entire submount surfaces, light-altering materials may be provided in reduced amounts while still redirecting laterally propagating light from the LED chips. Methods of selectively placing light-altering materials include selectively dispensing one or more droplets on submount portions that are proximate LED chip edges and allowing the one or more droplets to wick about the LED chip edges and portions of the submount before curing in place.
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
A display device includes a display panel, and a color conversion member disposed on the display panel. The color conversion member includes a plurality of partition walls disposed on the display panel and spaced apart from each other, and a color control part disposed between the plurality of partition walls. Each of the plurality of partition walls includes a first sub partition wall including a scattering body, and a second sub partition wall disposed on the first sub partition wall, and including a liquid repellent. The second sub partition wall has a higher light transmittance than the first sub partition wall.
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.
Phosphor with light barriers
A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.
DISPLAY DEVICE
A display device includes first banks on a substrate and spaced apart from each other, a first electrode and a second electrode on the first banks and spaced apart from each other, a first insulating layer on the first electrode and the second electrode, and light emitting elements on the first insulating layer and each having ends on the first electrode and the second electrode. Each of the first banks includes a first pattern portion including concave portions and convex portions. The first pattern portions of the first banks are disposed on side surfaces of the first banks. The side surfaces are spaced apart and face each other. Each of the first electrode and the second electrode includes a second pattern portion on the first pattern portion and having a pattern shape corresponding to the first pattern portion on a surface thereof.
Image display device
An image display device comprises a drive circuit substrate including a drive circuit that supplies currents to micro light-emitting elements to emit light; and the micro light-emitting elements arranged in an array shape on the drive circuit substrate, wherein a light-distribution control unit that increases forward light emission of the micro light-emitting elements is disposed on a light-emitting surface of each of the micro light-emitting elements, and a partition wall that does not transmit the light emitted by the micro light-emitting elements is disposed around the light-distribution control unit.
Light-emitting device package
A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.