Light extraction efficiency of existing semiconductor light emitting devices can be increased significantly by introducing a nanoparticle ‘meta-grid’ on top of a conventional light emitting diode (LED) chip, within its usual encapsulating packaging or casing. The ‘meta-grid’ is essentially a monolayer or a 2D array of sub-wavelength metallic nanoparticles (NPs) with sub-wavelength inter-particle separation. The local dielectric environment around the NPs and within the gaps between the NPs could be the same as the encapsulant, or any other optically transparent material with refractive index close to that of the encapsulant. Upon optical excitation, the collective oscillations of conduction electrons, or surface plasmon, of the metallic NPs give rise to localized surface plasmon resonances. When placed on top of the LED chip, which acts as a high refractive index substrate for the NPs, these NPs can couple strongly to the light emitted by the chip, acting as efficient resonant plasmonic antennae or scatterers for light. The plasmon-mediated light coupling can by optimized by tuning the composition, size, and shape of the NPs, their inter-particle gaps and their distance from the LED chip surface. By virtue of the localized-surface-plasmon-enhanced light transmission through the optimized NP ‘meta-grid’, the efficiency of extraction of the light generated by the semiconductor LED chip into its encapsulating casing can be significantly improved.

A method for manufacturing a planar light source includes preparing a wiring substrate including a first region that includes a light source placement section; disposing a light-reflective member in the first region of the wiring substrate; preparing a light guide plate including a first major surface, a second major surface opposite to the first major surface, and a first hole extending from the first major surface to the second major surface; disposing a light source on the light-reflective member at the light source placement section; disposing the light guide plate on the wiring substrate to cause the wiring substrate and the second major surface of the light guide plate to face each other to cause the light source to be positioned in the first hole; and disposing a first light-transmitting member in the first hole.

The display device comprises a light emitting element layer on a substrate and configured to emit light, a wavelength control layer on the light emitting element layer and configured to convert a wavelength of the light, a color filter layer on the wavelength control layer, and an anti-reflection layer on the color filter layer, wherein the anti-reflection layer includes a first inorganic layer on the color filter layer, a second inorganic layer on the first inorganic layer, and a coating layer on the second inorganic layer and including a dye.

A light-emitting device includes a component-mounting body including a first surface including a recess, and a light emitter mounted in the recess. The component-mounting body allows at least part of light emitted from the light emitter to be reflected from an inner peripheral surface of the recess at least twice.

An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.

A light emitting device, including a substrate, a light guiding element, multiple light sources, and multiple reflecting films. The light guiding element is disposed on the substrate and has multiple through holes. The light sources are disposed on the substrate and are respectively disposed in the through holes. The reflecting films respectively overlap with the light sources.

A micro light-emitting element includes a first conductivity type semiconductor layer including a lower surface on which an uneven pattern is formed, an active layer provided on the first conductivity type semiconductor layer, a second conductivity type semiconductor layer provided on the active layer, at least one electrode provided on the second conductivity type semiconductor layer, and a transparent coating layer including a first surface covering the lower surface of the first conductivity type semiconductor layer, and a second surface facing the first surface and having a second surface roughness that is less than a first surface roughness of the lower surface of the first conductivity type semiconductor layer.

An LED display screen module includes a module substrate and a plurality of LED package structures. The LED package structures are disposed on the module substrate and arranged into an array. Each of the LED package structures includes a plurality of pixels and a packaging layer. The pixels are spaced apart from each other. The packaging layer includes a plurality of packaging portions and a plurality of connecting portions. The packaging portions respectively cover the pixels, and each of the connecting portions is connected between the adjacent two packaging portions. Each of the packaging portions has an upper light emitting surface and a lateral light emitting surface. The upper light emitting surface is a flat surface and is connected to the lateral light emitting surface via a transitional curved surface.

Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.

A light emitting module includes at least one light source, a light guide member having a demarcating groove configured to demarcate at least one light emitting region, and at least one light source arrangement part located in each of the at least one light emitting region and accommodating a light source, a first light-reflecting member disposed in the demarcating groove, and a wavelength converting member covering an upper surface of the light guide member.