The invention relates to a method for producing a conversion element for an optoelectronic component comprising the steps of: A) Producing a first layer, for that purpose: A1) Providing a polysiloxane precursor material, which is liquid, A2) Mixing a phosphor to the polysiloxane precursor material, wherein the phosphor is suitable for conversion of radiation, A3) Curing the arrangement produced under step A2) to produce a first layer having a phosphor mixed in a cured polysiloxane material, which comprises a three-dimensional crosslinking network based primarily on T-units, where the ratio of T-units to all units is greater than 80%, B) Producing a phosphor-free second layer, for that purpose: B1) Providing the polysiloxane precursor material, which is liquid, B2) Mixing a filler to the polysiloxane precursor material, wherein the filler is in a cured and powdered form, wherein the filler has a refractive index, which is equal to the refractive index of the cured polysiloxane material, B3) Curing the arrangement produced under step B2) to produce a second layer having a filler mixed in the cured polysiloxane material, which comprises a three-dimensional crosslinking network based primarily on T-units, wherein the produced conversion element is formed as a plate having a thickness of at least 100 μm.

The present disclosure provides a lighting device and a manufacturing method thereof. The lighting device of an embodiment includes a substrate, a light emitting unit and a light adjusting layer. The light emitting unit is disposed on the substrate, and the light emitting unit includes a light output surface. The light adjusting layer is disposed on the light emitting unit, and the light adjusting layer includes a first portion and a second portion connected to the first portion. Wherein, the first portion only partially covers the light output surface, and the second portion does not cover the light output surface.

A light-emitting device includes a carrier with a first surface and a second surface opposite to the first surface; and a light-emitting unit disposed on the first surface and configured to emit a light toward but not passing through the first surface. When emitting the light, the light-emitting device has a first light intensity above the first surface, and a second light intensity under the second surface, a ratio of the first light intensity to the second light intensity is in a range of 2˜9.

Disclosed in the present application are a quantum dot LED, a manufacturing method thereof, and a display device, belonging to the technical field of LED light sources. The quantum dot LED includes an LED support, an LED chip, a filling layer, and a quantum dot layer, where the LED support comprises a chamber; the LED chip is arranged on a bottom surface of the chamber; the filling layer covers the bottom surface of the chamber and the LED chip, and is engaged with walls of the chamber; and the quantum dot layer is arranged at an opening on a top surface of the chamber, a light incident side of the quantum dot layer abuts against a surface of the filling layer away from the bottom surface of the chamber, and a shortest distance h between the LED chip and the quantum dot layer meets h≥0.03 mm.

A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

A backlight module and a display device including the backlight module are provided. The backlight module comprises a substrate and a plurality of miniature LEDs arranged on the substrate. The plurality of miniature LEDs comprise a miniature LED array, the miniature LED array comprises a plurality of LED sub-arrays, and the lighting parameters of each LED sub-array in the miniature LED array are independently controlled.

A method of manufacturing a light-emitting module according includes providing an intermediate structure, the intermediate structure including a board, and a plurality of light sources, and forming first and second wirings on an upper surface of the intermediate structure. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The forming of the first and second wirings includes forming the first extending portions and the first connecting portions and the second extending portions, forming an insulating member covering at least the first connecting portions while at least a portion of each of the second extending portions is exposed from the insulating member, and forming the second connecting portions on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring.

The present disclosure provides a lighting device and a manufacturing method thereof. The lighting device includes a substrate, a light emitting unit, a light adjusting layer and at least one electrode connecting element. The light emitting unit is disposed on the substrate and includes a light output surface and a plurality of top electrodes. The light adjusting layer is disposed on the light emitting unit, and the light adjusting layer includes a first portion and a second portion connected to the first portion. Wherein the top electrodes are electrically connected to each other through the electrode connecting element, the first portion only partially covers the light output surface, and the second portion does not cover the light output surface.

Darkening of the periphery of a light-emitting module in which a plurality of light-emitting units are two-dimensionally arranged is reduced.

The present light-emitting module has a light-emitting region including a plurality of light-emitting units two-dimensionally arranged, the light-emitting units each including a light-guiding plate having a first main surface, a first recess opening toward the first main surface, a second main surface opposite to the first main surface, and a second recess opening toward the second main surface; a light source inside the first recess; and a light-reflective first member inside the second recess. In each of the light-emitting units, a center of the light-emitting unit and a center of the second recess coincide with an optical axis of the light source in a plan view. In at least one of the light-emitting units, a center of the first member is closer to a center of the light-emitting region than the optical axis of the light source is in a plan view.

A tiled display device may include a first panel including a first display element layer; a second panel including a second display element layer; and a shared layer including a color conversion part. The shared layer may include a first portion and a second portion. The first portion may overlap the first panel in a plan view. The second portion may overlap the second panel in a plan view. The color conversion part may change a wavelength of light provided from the first panel and the second panel.