Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.

A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.

A waveguide flange adapter includes a plate; an aperture positioned through the plate; and a plurality of holes arranged in a pattern in the plate and around the aperture. The plate is configured to operatively connect a first waveguide to a second waveguide such that the first waveguide and the second waveguide have a different pattern of holes on the waveguide flanges to one another. The pattern of the plurality of holes may be configured to align with connecting holes in each of the first waveguide and the second waveguide. At least some of the plurality of holes may extend through an entire thickness of the plate. The plate may include electrically-conductive material. The size and shape of the aperture may be complementary to a size and shape of each of the first waveguide and the second waveguide. At least some of the plurality of holes may be tapped or untapped.

The present disclosure relates to a waveguide gasket arrangement (1, 1', 1") arranged for electrically sealing a waveguide interface (2) between a first waveguide end (3) and a second waveguide end (4). The waveguide gasket arrangement (1, 1', 1") comprises a carrier arrangement (5, 5', 5") where a carrier aperture (6; 6a, 6b) is formed in the mounted carrier arrangement (5, 5', 5"). The waveguide gasket arrangement (1, 1', 1") further comprises an electrically conducting flexible ribbon arrangement (7) that comprises at least one plurality of electrically conducting members (8a, 8b) forming a coherent common structure. The ribbon arrangement (7) is mounted to a carrier aperture edge (11; 11a, 11b) that circumvents the carrier aperture (6; 6a, 6b) such that for each plurality of electrically conducting members (8a, 8b), a first plurality of electrically conducting members (8a) is adapted to extend towards the first waveguide end (3) and a second plurality of electrically conducting members (8b) is adapted to extend towards the second waveguide end (4).

A battery pack includes a rack housing having a cabinet and a door provided to open and close the cabinet; a plurality of battery modules disposed in the cabinet in a layered form; a plurality of slave modules mounted to the battery modules one by one and having a slave antenna for wireless communication; a master module disposed at one of interlayer, top and bottom of the plurality of battery modules and having a master antenna for wireless communication; and a waveguide installed at an inner surface of the door to form a wireless communication path between the plurality of slave modules and the master module.

A structure that includes a signal trace embedded in a dielectric layer, the signal trace including a first contact pad at one end of the signal trace and a second contact pad at the other end of the signal trace. The dielectric layer has a first ground plane on a first surface and a second ground plane on a second opposing surface. A first conducting ground shield wall on a first side of the signal trace connects the first ground plane to the second ground plane. A second conducting ground shield wall on a second side of the signal trace connects the first ground plane to the second ground plane. The first ground plane, the second ground plane, the first conducting ground shield wall, and the second conducting ground shield wall enclose the signal trace.

An example waveguide connector is for making a blind-mate electrical connection between a first waveguide and a second waveguide. The waveguide connector includes a male part connected to the first waveguide, where the first waveguide includes a first conductive channel, and a female part connected to the second waveguide, where the second waveguide includes a second conductive channel. The female part includes a receptacle into which the male part slides to create the blind-mate electrical connection between the first conductive channel and the second conductive channel. A self-alignment feature is on at least one of the male part or the female part. The self-alignment feature is configured to guide the male part into the receptacle while correcting for misalignment of the male part and the female part

A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.

A method for producing a hollow conductor is specified. The hollow conductor has a first hollow-conductor section and a connecting section. The first hollow-conductor section contains a non-weldable aluminium alloy and the connecting section contains a weldable aluminium alloy. The method includes the step of: connecting the first hollow-conductor section to the connecting section by a laser-welding method.