The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastically supports the terminal part by means of an operation in which a hollow part is deformed in the vertical direction when an assembly force is transmitted to the terminal part supported to pass through the hollow part, wherein the terminal part comprises one terminal brought into contact with the electrode pad and the other terminal connected to the RF signal connecting part.

The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastically supports the terminal part by means of an operation in which a hollow part is deformed in the vertical direction when an assembly force is transmitted to the terminal part supported to pass through the hollow part, wherein the terminal part comprises one terminal brought into contact with the electrode pad and the other terminal connected to the RF signal connecting part.

A multi-mode transmission line includes a first and second conductive layers, first and second waveguide walls, a strip line, and a blind conductor. The second conductive layer that is formed over the first conductive layer. The first waveguide wall is elongated in a first direction and is in contact with the first conductive layer and the second conductive layer in a vertical direction. The second waveguide wall is elongated in the first direction parallel to the first waveguide wall and is in contact with the first conductive layer and the second conductive layer in the vertical direction. The strip line is formed between the first and second conductive layers and between the first and second waveguide walls. The blind conductor is connected to one of the first conductive layer, the second conductive layer, the first waveguide wall, or the second waveguide wall.

A balanced-type strip-shaped dielectric substrate integrated filter includes: a high-k dielectric substrate; and first low-k dielectric substrates, second low-k dielectric substrates and metal grounds are symmetrically stacked on upper and lower surfaces of the high-k dielectric substrate. Compared with an existing balanced-type dielectric filter, a high Q-value strip-shaped dielectric substrate integrated resonator with a packageable characteristic which works in TM.sub.111 mode and employs strip-shaped dielectric blocks with double grooves, combined with air groove structures of upper and lower layers and a packaging substrate is proposed, so that problems that cost is high and self-packaging cannot be realized of the existing balanced-type dielectric filter when being implemented by combining ceramic dielectric with a metal chamber structure can be solved, and thereby a balanced-type strip-shaped dielectric substrate integrated filter with the characteristic of low loss is realized; and meanwhile the filter may have advantages of self-packaging, high integration level and low cost.

A balanced-type strip-shaped dielectric substrate integrated filter includes: a high-k dielectric substrate; and first low-k dielectric substrates, second low-k dielectric substrates and metal grounds are symmetrically stacked on upper and lower surfaces of the high-k dielectric substrate. Compared with an existing balanced-type dielectric filter, a high Q-value strip-shaped dielectric substrate integrated resonator with a packageable characteristic which works in TM.sub.111 mode and employs strip-shaped dielectric blocks with double grooves, combined with air groove structures of upper and lower layers and a packaging substrate is proposed, so that problems that cost is high and self-packaging cannot be realized of the existing balanced-type dielectric filter when being implemented by combining ceramic dielectric with a metal chamber structure can be solved, and thereby a balanced-type strip-shaped dielectric substrate integrated filter with the characteristic of low loss is realized; and meanwhile the filter may have advantages of self-packaging, high integration level and low cost.

This application provides an example dielectric filter and an example communications device. The dielectric filter includes a dielectric block. At least two resonant through holes that are parallel to each other are provided in the dielectric block. The resonant through hole is a stepped hole. The stepped hole includes a large stepped hole and a small stepped hole that are arranged coaxially and that are in communication. The small stepped hole passes through a first surface of the dielectric block. The large stepped hole passes through a second surface of the dielectric block. A stepped surface is formed between the large stepped hole and the small stepped hole. The surfaces of the dielectric block are covered with conductor layers. The conductor layers cover the surfaces of the dielectric block and inner walls of the large stepped hole and the small stepped hole. A conductor layer of the inner wall of the large stepped hole is short-circuited with a conductor layer of the second surface. A conductor layer of the inner wall of the small stepped hole is short-circuited with a conductor layer of the first surface. A loop gap that does not cover the conductor layers is provided on the stepped surface. The loop gap is arranged around the small stepped hole.

A dielectric waveguide filter comprising a block of dielectric material including exterior surfaces covered with a layer of conductive material. A plurality of resonators are formed on the block. RF signal input/outputs are formed on the block. An RF signal is transmitted through the block in a serpentine pattern. In one embodiment, a RF signal transmission channel is formed in the block and extends between and surrounding selected ones of the plurality of resonators in a serpentine pattern. In one embodiment, selected ones of the plurality of resonators are comprised of respective islands of dielectric material formed on one of the top and bottom surfaces of the block of dielectric material surrounded by the channel and respective counter-bores formed and extending into the respective islands of dielectric material. In another embodiment, the respective islands of dielectric material and counter-bores defining the respective resonators are formed in opposed top and bottom surfaces of the block.

A band pass filter includes a dielectric substrate, conductor plates, a ground via, waveguide resonators, and a trap resonator. The conductor plates are inside the dielectric substrate and opposed to each other. The ground via connects the conductor plates together. The waveguide resonators are coupled in series in a space between the conductor plates along a principal coupling path from an input terminal to an output terminal. Waveguide resonators adjacent along the principal coupling path are subjected to inductive coupling. The trap resonator couples waveguide resonators in two pairs included in the waveguide resonators as jumping over a portion of the principal coupling path, and capacitive couples the waveguide resonators included in each of the pairs.

A multi-mode filter with a resonator having a plurality of resonator bodies which are rectangular prisms and the filter being configured with a through hole that electrically connects an input and an output to the center of a coupling structure between a respective pair of slabs. The multi-mode filter further comprising a plurality of coupling aperture segments which are coupling structures between each pair of resonator bodies or slabs such that two triangular apertures at opposite corners of at least two different slab-cube interfaces are utilized with the triangular apertures being diagonally opposed to one another across the respective interface.

A multi-mode filter with a resonator having a plurality of resonator bodies which are rectangular prisms and the filter being configured with a through hole that electrically connects an input and an output to the center of a coupling structure between a respective pair of slabs. The multi-mode filter further comprising a plurality of coupling aperture segments which are coupling structures between each pair of resonator bodies or slabs such that two triangular apertures at opposite corners of at least two different slab-cube interfaces are utilized with the triangular apertures being diagonally opposed to one another across the respective interface.