An electromagnetic coupler that couples antenna signals for a wideband antenna positioned between glass layers of an automotive windshield. The coupler includes a first co-planar waveguide (CPW) formed on one side of a glass layer and a second CPW formed on the other side of the glass layer, where the first and second CPWs are a mirror, or near-mirror, and 180° rotated images of each other. Both the first and second CPWs include a conductive plane where removed portions of the plane define a wide CPW section and a narrow CPW section that are electrically coupled to each other, and where the remaining portions of the conductive plane are ground planes, and where the electromagnetic signals are coupled through the glass layer between the wide CPW sections.

A passive radiofrequency microelectronic components for an integrated circuit which includes a dielectric substrate and at least one metal conductive layer positioned on said substrate. The conductive layer including at least one first metal conductive portion and a second metal conductive portion separated by an insulation. A microelectronic component according to the invention includes at least one graphene layer positioned so that a radiofrequency or hyperfrequency signal crosses said at least one graphene layer when it is transmitted between said first metal conductive portion and said second metal conductive portion, said graphene layer being able, when it is subject to an electric potential, to transmit said radiofrequency or hyperfrequency signal along a first direction and to attenuate said radiofrequency or hyperfrequency signal along a second direction opposite to said first direction.

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

A mode converter includes a substrate including a first main surface and a second main surface, a first ground conductor layer formed on the first main surface, a second ground conductor layer formed on the second main surface, a plane circuit that is formed on the first main surface and propagates a high frequency, a pin that is connected to the plane circuit, is formed inside a through-hole which penetrate from the first main surface to the second main surface, and communicates with the first main face and the second main surface, and an anti-pad that is formed between an end portion of the pin exposed in the second main surface and the second ground conductor layer.

Devices and/or computer-implemented methods facilitating static ZZ suppression and Purcell loss reduction using mode-selective coupling in two-junction superconducting qubits are provided. In an embodiment, a device can comprise a superconducting bus resonator. The device can further comprise a first superconducting qubit. The device can further comprise a second superconducting qubit, the first superconducting qubit and the second superconducting qubit respectively comprising: a first superconducting pad; a second superconducting pad; a third superconducting pad; a first Josephson Junction coupled to the first superconducting pad and the second superconducting pad; and a second Josephson Junction coupled to the second superconducting pad and the third superconducting pad. The first superconducting pad and the second superconducting pad of the first superconducting qubit and the second superconducting qubit are coupled to the superconducting bus resonator. The superconducting bus resonator entangles the first superconducting qubit and the second superconducting qubit based on receiving a control signal.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

A power divider includes two transmission lines (TLs), two capacitors and a resistor. Each TL has a first terminal, a second terminal, and a length that is 0.07 to 0.12 times an operation wavelength in the power divider. The TLs establish electromagnetic coupling therebetween. The first terminals of the TLs are connected together, and are to receive an input signal. One of the capacitors is connected to a common node of the TLs. The other capacitor and the resistor are connected in parallel between the second terminals of the TLs. The second terminals of the TLs are to respectively provide two output signals which are in-phase, and each of which has a frequency equal to that of the input signal.

In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Base station antenna feed boards are provided. A base station antenna feed board includes a phase shifter and a hybrid radio frequency transmission line that is coupled to the phase shifter. The hybrid radio frequency transmission line includes a coplanar waveguide and a microstrip line. Related base station antennas are also provided.

A microwave or radio frequency (RF) device includes a substrate including an electrically insulating material. The substrate has a first surface and a second surface parallel to the first surface. The device further includes a RF component disposed over the first surface of the substrate. The device also includes a conductive layer disposed over the second surface of the substrate, the conductive layer forming a ground plane electrically insulated from the RF component. The device further includes a defected ground structure disposed on a surface of the substrate that is coplanar with the first surface, where the defected ground structure is electrically connected to the conductive layer, and where the defected ground structure includes a plurality of laterally extending members adjacent to the RF component and extending laterally in relation to the RF component.