A method produces a semiconductor apparatus for a quantum computer. The apparatus includes: a semiconductor substrate; a quantum computer device formed on the semiconductor substrate; and a peripheral circuit formed on the semiconductor substrate and connected to the quantum computer device. The apparatus is to be used as a quantum computer. The method includes: a step of forming the quantum computer device and the peripheral circuit on the semiconductor substrate; and a step of deactivating a carrier in the semiconductor substrate by irradiation of a particle beam to at least a formation part for the quantum computer device and a formation part for the peripheral circuit in the semiconductor substrate. The method for producing a semiconductor apparatus for a quantum computer can produce a semiconductor apparatus for a quantum computer having excellent 3HD characteristics.

Disclosed are a quantum chip and a fabrication method therefor. The quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through the insulating substrate are formed on the insulating substrate, a metal piece is formed in the through hole, and two ends of the metal piece are electrically connected to the signal transmission lines and the qubit, respectively.

Various system embodiments for millimeter-wave chip packaging are disclosed in the present disclosure for smooth millimeter wave signal transition and good multi-channel signal isolation. The chip packaging features a substrate and a chip electrically connected using a plurality of metal pillars. A signal pillar and surrounding metal pillar may form a ground-signal-ground (GSG) pillar structure. A chip coplanar waveguide (CPW) structure may be formed on the chip around a signal path. A substrate CPW structure may also be form around a signal strip, which is electrically connected to the signal path. Characteristic impedances of the GSG pillar structure, the chip CPW structure and the substrate CPW structure may be within a predetermined range of each other to ensure smooth millimeter wave signal transition with minimum signal loss or distortion.

Various system embodiments for millimeter-wave chip packaging are disclosed in the present disclosure for smooth millimeter wave signal transition and good multi-channel signal isolation. The chip packaging features a substrate and a chip electrically connected using a plurality of metal pillars. A signal pillar and surrounding metal pillar may form a ground-signal-ground (GSG) pillar structure. A chip coplanar waveguide (CPW) structure may be formed on the chip around a signal path. A substrate CPW structure may also be form around a signal strip, which is electrically connected to the signal path. Characteristic impedances of the GSG pillar structure, the chip CPW structure and the substrate CPW structure may be within a predetermined range of each other to ensure smooth millimeter wave signal transition with minimum signal loss or distortion.

A system that includes: an array of qubits, each qubit of the array of qubits comprising a first electrode corresponding to a first node and a second electrode corresponding to a second node, wherein, for a first qubit in the array of qubits, the first qubit is positioned relative to a second qubit in the array of qubits such that a charge present on the first qubit induces a same charge on each of the first node of the second qubit and the second node of the second qubit, such that coupling between the first qubit and the second qubit is reduced, and wherein none of the nodes share a common ground is disclosed.

An electronic device includes a first body and a second body rotatably connected relative to each other through a pivot shaft having a metal portion, the first body including a first motherboard, the second body including a second motherboard; and a radio-frequency transmission line including at least one band-shaped line segment and at least two coplanar waveguide segments, the band-shaped line segment being coupled to the coplanar waveguide segments, in which one band-shaped line segment is located between two coplanar waveguide segments in an extending direction of the radio-frequency transmission line, the one band-shaped line segment is coupled to the pivot shaft to retain stationary relative to the pivot shaft, and the coplanar waveguide segments are spaced apart from the metal portion. The radio-frequency transmission line has a first end coupled to the first motherboard, and a second end coupled to the second motherboard.

A slot antenna includes a substrate having a first side and a second side, a first conductive layer on the first side of the substrate, and a second conductive layer on the second side of the substrate. A first aperture is in the first conductive layer, a second aperture is in the first conductive layer, a first slotline is in the first conductive layer and in communication with the first aperture, and a second slotline is in the first conductive layer and in communication with the second aperture. A third aperture can be in the second conductive layer. A plurality of vias can be in the substrate and surrounding at least a portion of a region including the first aperture, the second aperture, the first slotline, and the second slotline, each of the vias extending through the substrate from the first conductive layer to the second conductive layer.

A qubit memory of a quantum computer is provided. The qubit memory according to an embodiment includes a first readout unit, a first transmon, and a first data storage unit storing quantum information, and the first data storage unit includes a first superconducting waveguide layer, an insulating layer, and a superconductor layer sequentially stacked on a substrate. In one example, the first superconducting waveguide layer may include a superconducting resonator.

In a method of testing a multilayer structure containing a magnetic layer, one or more network parameters are measured of a waveguide that is electromagnetically coupled with the multilayer structure as a function of frequency and as a function of a magnetic field applied to the multilayer structure during the measuring of the network parameters. Based on the measured one or more network parameters, at least one magnetic property of the magnetic layer of the multilayer structure is determined. The network parameters in some embodiments are S-parameters. The at least one magnetic property may include an effective anisotropy field of the magnetic layer and/or a damping constant of the magnetic layer.

A waveguide includes: a substrate; a first ground wire; a second ground wire; a signal wire; and a compensation structure. The first ground wire, the second ground wire, and the signal wire are disposed on the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire. The compensation structure is configured to contact at least one of the substrate, the first ground wire, the second ground wire, or the signal wire; and the compensation structure comprises a superconducting material.