A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

A quantum computing device includes multiple co-planar waveguide flux qubits, at least one coupler element arranged such that each co-planar waveguide flux qubit, of the multiple co-planar waveguide flux qubits, is operatively couplable to each other co-planar waveguide flux qubit, of the multiple co-planar waveguide flux qubits, of the quantum computing device, and a tuning quantum device, in which the tuning quantum device is in electrical contact with a first co-planar waveguide flux qubit of the plurality of co-planar waveguide flux qubits and with a second co-planar waveguide flux qubit of the plurality of co-planar waveguide flux qubits.

A polycrystal having a physical property that enables an AC resistance value to drop sharply is used to reduce transmission loss of a high frequency signal being transmitted. A high frequency transmission device D1 is provided that includes a dielectric 100 and a transmission line 200 adapted for transmitting therethrough high frequency signals. At least part of the transmission line 200 is located on or inside the dielectric 100. At least part of the transmission line 200 is composed of a polycrystal composed of conductor fine particles. The polycrystal has a physical property such that, when a high frequency signal to be transmitted through the transmission line 200 is of frequencies within one or more specific frequency bands, the AC resistance value drops sharply.

Methods, apparatuses, and devices for quantum chip preparation include acquiring a coplanar waveguide in a quantum chip; and establishing a connecting bridge on the coplanar waveguide using a bonding machine, wherein the connecting bridge is configured to connect a first reference ground and a second reference ground located on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency. A quantum chip includes a transmission line configured for signal transmission; and a resonant cavity coupled to the transmission line and configured to regulate an operating state of qubits on the quantum chip, wherein the transmission line and the resonant cavity are both composed of a coplanar waveguide, the coplanar waveguide is provided with a connecting bridge, and the connecting bridge is configured to connect a first reference ground and a second reference ground on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency.

A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.

An integrated circuit device includes a semiconductor substrate having a resistivity of at least 100 Ω.Math.cm. An electrically insulating layer contacts the semiconductor substrate. The electrically insulating layer is susceptible of inducing in the semiconductor substrate a parasitic surface conduction layer that interfaces with the electrically insulating layer. An electrical circuit is located on the electrically insulating layer. The electrical circuit includes a section capable of inducing an electrical field in the semiconductor substrate. The integrated circuit device includes a depletion-inducing junction of which at least a portion is comprised in the semiconductor substrate. The depletion-inducing junction can autonomously induce in the semiconductor substrate a depleted zone that interfaces with a section of the electrically insulating layer that lies in-between two sections of the electrical circuit.

A radiofrequency transmission line configured so as to allow a radiofrequency electrical signal to be transmitted between a first end and a second end, the transmission line including a main conductor and a ground plane electrically connected to an electrical ground of the transmission line. The ground plane includes a set of portions that are connected in series between the first end and the second end and a set of second capacitors, the set of portions including a set of second portions, each second capacitor being inserted between two contiguous second portions.

The magnetic detector 1 according to the present disclosure includes a transmission line 10 having a linear first conductor 11 including a magnetic material, a signal generator 30 configured to input a pulse as an incident wave to the transmission line 10, and a calculator 20 configured to detect a reflected wave caused by impedance mismatching at a magnetic field application position of the transmission line 10 and the incident wave. The calculator 20 calculates a position and a strength of the magnetic field applied to the transmission line 10 on the basis of the incident wave and the reflected wave.

A transmission line substrate includes a line portion and a connecting portion. The transmission line substrate includes a base material, a first ground conductor, a second ground conductor, a signal line, an external electrode, a second interlayer connection conductor. In the line portion, a transmission line having a strip line structure including the signal line, the first ground conductor, and the second ground conductor is provided. In the connecting portion, the signal line and the external electrode face each other in a stacking direction, without including therebetween an interlayer connection conductor. The second interlayer connection conductor surrounds a facing portion in which the signal line and the external electrode face each other in the Z-axis direction.

Josephson junctions (JJ) based on bilayers of azimuthally misaligned two-dimensional materials having superconducting states are provided. Also provided are electronic devices and circuits incorporating the JJs as active components and methods of using the electronic devices and circuits. The JJs are formed from bilayers composed of azimuthally misaligned two-dimensional materials having a first superconducting segment and a second superconducting segment separated by a weak-link region that is integrated into the bilayer.