An adjustable frame assembly for augmented reality eyewear. The frame assembly includes a face portion for supporting at least one waveguide that creates an eye box, a support rest for supporting the face portion on a user, and a coupling for adjusting the position of the face portion relative to the support rest. This enables movement of the waveguide eye box relative to the support rest to position the eye box in front of the wearer's eyes.

An adjustable frame assembly for augmented reality eyewear. The frame assembly includes a face portion for supporting at least one waveguide that creates an eye box, a support rest for supporting the face portion on a user, and a coupling for adjusting the position of the face portion relative to the support rest. This enables movement of the waveguide eye box relative to the support rest to position the eye box in front of the wearer's eyes.

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

Provided are waveguide sensors and position sensing systems. In some embodiments, a position sensing system may include a waveguide configured to receive and transmit a pulse, and a magnet moveable relative to the waveguide. The waveguide may include a first core layer and a second core layer, a magnetic layer between the first and second core layers, and a conductive winding around the first core layer, the second core layer, and the magnetic layer. The position sensing system may further include a first substrate layer above the conductive winding and a second substrate layer below the conductive winding.

Provided are waveguide sensors and position sensing systems. In some embodiments, a position sensing system may include a waveguide configured to receive and transmit a pulse, and a magnet moveable relative to the waveguide. The waveguide may include a first core layer and a second core layer, a magnetic layer between the first and second core layers, and a conductive winding around the first core layer, the second core layer, and the magnetic layer. The position sensing system may further include a first substrate layer above the conductive winding and a second substrate layer below the conductive winding.

A surface-wave waveguide may include a base conductive ground plane including opposite side edges and a pair of conductive side walls. One conductive side wall extends from each side edge of the conductive ground plane. The surface-wave waveguide may also include a substrate including a dielectric material disposed on the base conductive ground plane and between the conductive side walls. The surface-wave waveguide may also include an impedance sheet disposed on the substrate and between the conductive side walls. The impedance sheet may include a predetermined impedance characteristic for transmitting an electromagnetic wave.

A surface-wave waveguide may include a base conductive ground plane including opposite side edges and a pair of conductive side walls. One conductive side wall extends from each side edge of the conductive ground plane. The surface-wave waveguide may also include a substrate including a dielectric material disposed on the base conductive ground plane and between the conductive side walls. The surface-wave waveguide may also include an impedance sheet disposed on the substrate and between the conductive side walls. The impedance sheet may include a predetermined impedance characteristic for transmitting an electromagnetic wave.

A transmission line structure for transmitting radio signals includes a first transmission line, a first ground region, and a second transmission line. The first transmission line is arranged on a first layer of a circuit board. The first transmission line includes a first signal line and a second signal line. The first ground region is arranged between the first and second signal lines. The first and second signal lines do not contact the first ground region. The second transmission line is arranged on a second layer of the circuit board, and the second layer is different from the first layer. The second transmission line does not contact the first transmission line, and the second transmission line interleaves with the first signal line, the second signal line and the first ground area.

A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.