An assembly for a radio frequency filter includes: an elongate pedestal with an upper surface; a resonator; a tuning member that is positioned above the resonator; and a screw that mounts the resonator to the upper surface of the pedestal, the screw including a shank with a thread and a head, the head including a plurality of recesses configured to receive a tool, the recesses extending through the head.

An assembly for a radio frequency filter includes: an elongate pedestal with an upper surface; a resonator; a tuning member that is positioned above the resonator; and a screw that mounts the resonator to the upper surface of the pedestal, the screw including a shank with a thread and a head, the head including a plurality of recesses configured to receive a tool, the recesses extending through the head.

Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.

A coupling assembly is provided. More specifically, the coupling assembly is configured to form a quick, preferably mechanical and electromagnetic, connection between two devices such as a radio and antenna. The coupling assembly has interchangeable portions can be easily adjusted or adapted to swap parts such as waveguides having different sizes and dimensions while maintaining a standard connection portion that can be used with the different sized and shaped parts, thereby reducing manufacturing costs and increasing the efficiency of field installations.

A coupling assembly is provided. More specifically, the coupling assembly is configured to form a quick, preferably mechanical and electromagnetic, connection between two devices such as a radio and antenna. The coupling assembly has interchangeable portions can be easily adjusted or adapted to swap parts such as waveguides having different sizes and dimensions while maintaining a standard connection portion that can be used with the different sized and shaped parts, thereby reducing manufacturing costs and increasing the efficiency of field installations.

A semiconductor structure and a method of forming the same are provided. A method of manufacturing the semiconductor structure includes: providing a substrate; depositing a first dielectric layer over the substrate; attaching a waveguide to the first dielectric layer; depositing a second dielectric layer to laterally surround the waveguide; and forming a first conductive member and a second conductive member over the second dielectric layer and the waveguide, wherein the first conductive member and the second conductive member are in contact with the waveguide. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

A battery pack includes a rack housing having a cabinet and a door provided to open and close the cabinet; a plurality of battery modules disposed in the cabinet in a layered form; a plurality of slave modules mounted to the battery modules one by one and having a slave antenna for wireless communication; a master module disposed at one of interlayer, top and bottom of the plurality of battery modules and having a master antenna for wireless communication; and a waveguide installed at an inner surface of the door to form a wireless communication path between the plurality of slave modules and the master module.

A battery pack includes a rack housing having a cabinet and a door provided to open and close the cabinet; a plurality of battery modules disposed in the cabinet in a layered form; a plurality of slave modules mounted to the battery modules one by one and having a slave antenna for wireless communication; a master module disposed at one of interlayer, top and bottom of the plurality of battery modules and having a master antenna for wireless communication; and a waveguide installed at an inner surface of the door to form a wireless communication path between the plurality of slave modules and the master module.