A semiconductor structure and a method of forming the same are provided. A method of manufacturing the semiconductor structure includes: providing a substrate; depositing a first dielectric layer over the substrate; attaching a waveguide to the first dielectric layer; depositing a second dielectric layer to laterally surround the waveguide; and forming a first conductive member and a second conductive member over the second dielectric layer and the waveguide, wherein the first conductive member and the second conductive member are in contact with the waveguide. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.

A dielectric waveguide filter comprising a block of dielectric material including exterior surfaces covered with a layer of conductive material. A plurality of resonators are formed on the block. RF signal input/outputs are formed on the block. An RF signal is transmitted through the block in a serpentine pattern. In one embodiment, a RF signal transmission channel is formed in the block and extends between and surrounding selected ones of the plurality of resonators in a serpentine pattern. In one embodiment, selected ones of the plurality of resonators are comprised of respective islands of dielectric material formed on one of the top and bottom surfaces of the block of dielectric material surrounded by the channel and respective counter-bores formed and extending into the respective islands of dielectric material. In another embodiment, the respective islands of dielectric material and counter-bores defining the respective resonators are formed in opposed top and bottom surfaces of the block.

A dielectric waveguide filter comprising a block of dielectric material including exterior surfaces covered with a layer of conductive material. A plurality of resonators are formed on the block. RF signal input/outputs are formed on the block. An RF signal is transmitted through the block in a serpentine pattern. In one embodiment, a RF signal transmission channel is formed in the block and extends between and surrounding selected ones of the plurality of resonators in a serpentine pattern. In one embodiment, selected ones of the plurality of resonators are comprised of respective islands of dielectric material formed on one of the top and bottom surfaces of the block of dielectric material surrounded by the channel and respective counter-bores formed and extending into the respective islands of dielectric material. In another embodiment, the respective islands of dielectric material and counter-bores defining the respective resonators are formed in opposed top and bottom surfaces of the block.

Apparatus including a first transmission line for transmitting radio frequency, RF, signals and at least one RF device including at least one active semiconductor device for processing RF signals, wherein said at least one RF device is coupled to said first transmission line, and wherein said first transmission line includes an electro-chromic, EC, material a permittivity of which can be controlled by applying a first control voltage to said first transmission line.

Apparatus including a first transmission line for transmitting radio frequency, RF, signals and at least one RF device including at least one active semiconductor device for processing RF signals, wherein said at least one RF device is coupled to said first transmission line, and wherein said first transmission line includes an electro-chromic, EC, material a permittivity of which can be controlled by applying a first control voltage to said first transmission line.

A band pass filter includes a dielectric substrate, conductor plates, a ground via, waveguide resonators, and a trap resonator. The conductor plates are inside the dielectric substrate and opposed to each other. The ground via connects the conductor plates together. The waveguide resonators are coupled in series in a space between the conductor plates along a principal coupling path from an input terminal to an output terminal. Waveguide resonators adjacent along the principal coupling path are subjected to inductive coupling. The trap resonator couples waveguide resonators in two pairs included in the waveguide resonators as jumping over a portion of the principal coupling path, and capacitive couples the waveguide resonators included in each of the pairs.

A system for bidirectional transmission in a plastic waveguide of a plurality of signals, between a first transceiver device and a second transceiver device, the plurality of signals comprising a payload carrier signal and one or more reference signals generated by one or more local oscillators on different frequencies, the first transceiver device being a power radio transceiver device, the second transceiver device being a multisignal transceiver device with no energy consumption which comprises a passive transmitter and a passive receiver.

A system for bidirectional transmission in a plastic waveguide of a plurality of signals, between a first transceiver device and a second transceiver device, the plurality of signals comprising a payload carrier signal and one or more reference signals generated by one or more local oscillators on different frequencies, the first transceiver device being a power radio transceiver device, the second transceiver device being a multisignal transceiver device with no energy consumption which comprises a passive transmitter and a passive receiver.

A microwave transmission arrangement, comprising an electrically conductive hollow waveguide having a first waveguide portion, a second waveguide portion between the first waveguide portion and a first end of the hollow waveguide, and a conductive transition surface of the hollow waveguide forming a transition between the first waveguide portion and the second waveguide portion; and a microwave circuit board including a dielectric carrier, and a first conductor pattern on a first side of the dielectric carrier, the first conductor pattern including a patch for radiating or receiving microwave signals in the predefined wavelength range, and a first ground plane surrounding the patch, wherein the first ground plane of the microwave circuit board is in conductive contact with the first end of the hollow waveguide, and extends into the second waveguide portion cross-section area to define at least one conductive pocket together with the second waveguide portion and the transition surface of the hollow waveguide.

A microwave transmission arrangement, comprising an electrically conductive hollow waveguide having a first waveguide portion, a second waveguide portion between the first waveguide portion and a first end of the hollow waveguide, and a conductive transition surface of the hollow waveguide forming a transition between the first waveguide portion and the second waveguide portion; and a microwave circuit board including a dielectric carrier, and a first conductor pattern on a first side of the dielectric carrier, the first conductor pattern including a patch for radiating or receiving microwave signals in the predefined wavelength range, and a first ground plane surrounding the patch, wherein the first ground plane of the microwave circuit board is in conductive contact with the first end of the hollow waveguide, and extends into the second waveguide portion cross-section area to define at least one conductive pocket together with the second waveguide portion and the transition surface of the hollow waveguide.