Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Disclosed are various embodiments for transmitting energy at multiple frequencies via a guided surface wave along the surface of a lossy medium such as, e.g., a terrestrial medium by exciting a guided surface waveguide probe.

Disclosed are various embodiments for transmitting energy at multiple frequencies via a guided surface wave along the surface of a lossy medium such as, e.g., a terrestrial medium by exciting a guided surface waveguide probe.

An interventional medical device includes an insertion tube extending between a proximal end and a distal end. The distal end configured to be inserted into internal tissues of a patient during a medical procedure. The insertion tube has a dielectric waveguide extending between the proximal end and the distal end. The interventional medical device includes a transmitter coupled to the dielectric waveguide at the distal end. The transmitter transmits a radio frequency signal along the dielectric waveguide from the distal end to the proximal end.

A transmission line includes a dielectric base body including stacked dielectric layers. A first signal conductor, a second signal conductor, and a ground conductor are included inside the dielectric base body. The first signal conductor includes a first end portion signal conductor and a second end portion signal conductor, which are two end portions in a transmitting direction, and a signal conductor that defines and functions as a main conductor portion. A signal conductor of the second signal conductor and the main conductor portion are provided on different dielectric layers. The signal conductor of the second signal conductor and the signal conductor of the first signal conductor are formed on the same dielectric layer. The ground conductor has an increased width and is located between the signal conductor of the second signal conductor and the main conductor portion in a stacking direction.

Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.

Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.

An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

Embodiments of a radio frequency feedline structure. A first printed circuit board (PCB) includes upper and lower metal layers and at least one cutout defining an upper portion of an open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. A second PCB includes upper and lower metal layers and elongated slots defining a suspended signal path within the open channel. The upper and lower metal layers are electrically connected by vias. A third PCB includes upper and lower metal layers and at least one cutout defining a lower portion of the open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. Respective upper and lower ground planes are electrically connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.