Patent classifications
H01P5/02
PILLBOX-TYPE RF WINDOW AND MANUFACTURING METHOD THEREFOR
A pillbox-type RF window having an input/output window in a microwave tube, the pillbox-type RF window includes a disc-shaped member having a metallization layer formed on an outer peripheral portion of a disc-shaped ceramic body; a pair of ring-shaped members constituted by metal bodies having substantially the same outer diameters as the disc-shaped member, arranged to sandwich the disc-shaped member from both sides, and integrated with the outer peripheral portion of the disc-shaped member; a tube-shaped member constituted by a metal body having an inner diameter substantially equal to the outer diameters of the pair of ring-shaped members and the disc-shaped member, for holding the pair of metal components and the disc-shaped member on an inside thereof; and a restriction member for suppressing rotation between the ring-shaped members and the tube-shaped member.
MULTIBAND WAVEGUIDE QUICK COUPLING
A coupling assembly is provided. More specifically, the coupling assembly is configured to form a quick, preferably mechanical and electromagnetic, connection between two devices such as a radio and antenna. The coupling assembly has interchangeable portions can be easily adjusted or adapted to swap parts such as waveguides having different sizes and dimensions while maintaining a standard connection portion that can be used with the different sized and shaped parts, thereby reducing manufacturing costs and increasing the efficiency of field installations.
MULTIBAND WAVEGUIDE QUICK COUPLING
A coupling assembly is provided. More specifically, the coupling assembly is configured to form a quick, preferably mechanical and electromagnetic, connection between two devices such as a radio and antenna. The coupling assembly has interchangeable portions can be easily adjusted or adapted to swap parts such as waveguides having different sizes and dimensions while maintaining a standard connection portion that can be used with the different sized and shaped parts, thereby reducing manufacturing costs and increasing the efficiency of field installations.
LOW FOOTPRINT RESONATOR IN FLIP CHIP GEOMETRY
A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.
POWER AMPLIFIER UNIT
A power amplifier unit includes a power amplifier circuit that amplifies a radio-frequency input signal, a first impedance matching circuit that performs impedance matching for an output signal of the power amplifier circuit, a second-order harmonic termination circuit on an output side of the first impedance matching circuit and that reflects at least part of even-ordered and odd-ordered harmonics contained in a signal input from the first impedance matching circuit to output the at least part of the harmonics from an input terminal as a radio-frequency signal and outputs a radio-frequency signal containing a fundamental and the remainder of the harmonics from an output terminal, and a filter that is on a subsequent stage of the second-order harmonic termination circuit, that attenuates at least part of the even-ordered and odd-ordered harmonics, and that outputs a radio-frequency signal including the fundamental and the remainder of the even-ordered and odd-ordered harmonics.
SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE
A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.
SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE
A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.
Printed circuit board for base station antenna
Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.
CONDUCTOR TRACK ARRANGEMENT FOR HIGH-FREQUENCY SIGNALS, BASE AND ELECTRONIC COMPONENT HAVING A CONDUCTOR TRACK ARRANGEMENT
A conductor track arrangement for high-frequency signals is provided. The arrangement includes a carrier, a ground conductor, and a pair of signal conductors. The signal conductors are layered and are arranged on the carrier opposite the ground conductor. A distance is between the signal conductors, which have a deflection region, in which a direction of the signal conductors changes. The deflection region has a reduced distance, which is reduced compared to the distance d between the signal conductors outside the deflection region. The distance between the signal conductors in transition regions from straight portions of the signal conductors into the deflection region is reduced here symmetrically with respect to an extension of a centre line between the two signal conductors into their respective straight portions and/or a capacitor is introduced into the signal conductor considered to be the inner signal conductor in respect of the direction change.
Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other
A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.