H01P5/08

Transition from a stripline to a waveguide
11552379 · 2023-01-10 · ·

The invention relates to a transition from a stripline to a waveguide, wherein: the stripline, preferably a microstrip line, is located on a substrate; an upper side of the substrate has a metallised surface and the lower side of the substrate has a metal layer, preferably a high-frequency ground-potential layer; the upper side and the lower side are connected to vias; and at least part of the metallised surface on the upper side of the substrate acts as a waveguide wall.

Transition from a stripline to a waveguide
11552379 · 2023-01-10 · ·

The invention relates to a transition from a stripline to a waveguide, wherein: the stripline, preferably a microstrip line, is located on a substrate; an upper side of the substrate has a metallised surface and the lower side of the substrate has a metal layer, preferably a high-frequency ground-potential layer; the upper side and the lower side are connected to vias; and at least part of the metallised surface on the upper side of the substrate acts as a waveguide wall.

TRANSMISSION LINE AND ELECTRONIC DEVICE
20230216168 · 2023-07-06 ·

In a transmission line, a thickness of a second section is smaller than that of a first section and of a third section. A center of the second section is above a center of the first section and a center of the third section in a laminated body up-down direction. A distance between a second signal conductor layer and a neutral plane of the second section is shorter than a distance between a first signal conductor layer and a neutral plane of the second section and a distance between a third signal conductor layer and a neutral plane of the second section in the laminated body up-down direction. A length of the second signal conductor layer between first and second interlayer connection conductors is equal to or less than about ½ of a wavelength of a high-frequency signal transmitted by the transmission line.

High density microwave hermetic interconnects for quantum applications

A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

REMOVABLE CONTACTLESS PROBE
20220413012 · 2022-12-29 ·

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

Cavity filter
11522260 · 2022-12-06 · ·

The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastically supports the terminal part by means of an operation in which a hollow part is deformed in the vertical direction when an assembly force is transmitted to the terminal part supported to pass through the hollow part, wherein the terminal part comprises one terminal brought into contact with the electrode pad and the other terminal connected to the RF signal connecting part.

Transition in a multi-layer substrate between a substrate integrated waveguide portion and a coplanar waveguide portion

Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.

Transition in a multi-layer substrate between a substrate integrated waveguide portion and a coplanar waveguide portion

Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.

High density waveguide assembly for millimeter and 5G applications
11506686 · 2022-11-22 · ·

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

High density waveguide assembly for millimeter and 5G applications
11506686 · 2022-11-22 · ·

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.