A double-disc structure for self-biased circulators monolithically integrated on semiconductors is provided. A self-based circulator is attractive due to the great reduction in its size and weight compared to conventional circulators which have bulk permanent magnets. The development of miniaturized self-biased circulators enables monolithic integration of such circulators directly into monolithic integrated circuits (e.g., monolithic microwave integrated circuits (MMICs)) on a single chip and opens the door to full-duplex communication in radio frequency (RF) bands higher than Ka band, without suffering from the additional losses through connectors. This disclosure demonstrates a new double-disc structure by using two self-biased discs in a circulator device, which greatly improve its insertion loss, isolation, bandwidth, and power handling capability.

A double-disc structure for self-biased circulators monolithically integrated on semiconductors is provided. A self-based circulator is attractive due to the great reduction in its size and weight compared to conventional circulators which have bulk permanent magnets. The development of miniaturized self-biased circulators enables monolithic integration of such circulators directly into monolithic integrated circuits (e.g., monolithic microwave integrated circuits (MMICs)) on a single chip and opens the door to full-duplex communication in radio frequency (RF) bands higher than Ka band, without suffering from the additional losses through connectors. This disclosure demonstrates a new double-disc structure by using two self-biased discs in a circulator device, which greatly improve its insertion loss, isolation, bandwidth, and power handling capability.

Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

A transition unit providing a radio frequency signal transition between a radio frequency hollow waveguide system and a planar transmission line comprises two or more transition sections of transmission line arranged adjacent to each other at a first surface of the first substrate layer of a substrate layer arrangement. The hollow waveguide system comprises a distribution section. One input waveguide is separated into one dedicated output waveguide for each of the transition sections. For each of the transition sections of the transmission lines a corresponding end section of a respective output waveguide is directed perpendicular to the first surface of the first substrate layer. For each end section an open end of the end section of the waveguide system superposes the corresponding transition section. The two or more end sections are arranged adjacent to each other in order to provide for favorable boundary conditions for electromagnetic wave propagation.

A microwave system includes a molding compound layer having opposing first and second surfaces, an integrated circuit device at least partially surrounded by said molding compound layer to define a fan-out area located laterally outside the integrated circuit device's outline, a plurality of through-mold vias within said fan-out area extending through said molding compound layer between said first and second surfaces, a re-distribution layer stack extending parallel to said second surface and comprising conducting signal paths, and a substrate comprising a first surface extending parallel to the molding compound layer. The re-distribution layer stack is positioned on top of an array of solder balls carried by the substrate. The system also includes two coupling slots arranged on different levels to resonantly couple with each other, and at least one hollow waveguide with an open (coupling) aperture at one end in direct proximity of one of said two coupling slots.

A microwave system includes a molding compound layer having opposing first and second surfaces, an integrated circuit device at least partially surrounded by said molding compound layer to define a fan-out area located laterally outside the integrated circuit device's outline, a plurality of through-mold vias within said fan-out area extending through said molding compound layer between said first and second surfaces, a re-distribution layer stack extending parallel to said second surface and comprising conducting signal paths, and a substrate comprising a first surface extending parallel to the molding compound layer. The re-distribution layer stack is positioned on top of an array of solder balls carried by the substrate. The system also includes two coupling slots arranged on different levels to resonantly couple with each other, and at least one hollow waveguide with an open (coupling) aperture at one end in direct proximity of one of said two coupling slots.

A combiner/divider includes a plurality of input/output waveguides distributed in a plane and diverging in at least a partially common direction away from a central point. Each input/output waveguide extends from an outer node disposed distal of the central point to an inner port proximate to and spaced from the central point. Each input/output waveguide has a respective dimension in the plane that increases between the inner port and the outer node. An output/input waveguide has an aggregate port proximate to the central point and facing the inner ports. A transition waveguide defines an open cavity that flares outwardly in the plane from the aggregate port toward the inner ports and communicatively couples the output/input waveguide with the input/output waveguides. Opposing distal surfaces of the transition waveguide and inner port edges are spaced apart by a distance that decreases with increasing distance from the aggregate port.

Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.