A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.

A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

An antenna unit, a radio unit, and a base station are disclosed. The antenna unit or the radio unit includes a plurality of filters, each having a respective radio frequency passband. At least one first filter is a CWG filter. The first filter is coupled to a second filter through a T-junction formed on an antenna board or a radio mother board.

An antenna unit, a radio unit, and a base station are disclosed. The antenna unit or the radio unit includes a plurality of filters, each having a respective radio frequency passband. At least one first filter is a CWG filter. The first filter is coupled to a second filter through a T-junction formed on an antenna board or a radio mother board.

The present invention relates to the field of communications technologies and discloses a phase shifter and a feed network. The phase shifter includes at least one phase shift component. The phase shift component includes a substrate, a microstrip coupling structure disposed on a first plane of the substrate, a microstrip transmission line connected to and coplanar with the microstrip coupling structure, and a microstrip/coplanar-waveguide coupling structure, where the microstrip/coplanar-waveguide coupling structure includes a microstrip connected to and coplanar with the microstrip transmission line, and a coplanar waveguide disposed opposite to the microstrip on the substrate and coupled with the microstrip. A phase shifter using a microstrip/coplanar-waveguide coupling structure has a small volume and costs low, thereby facilitating feed network design.

Techniques relate to an on-chip Josephson parametric converter. A Josephson ring modulator includes four nodes. A lossless on-chip flux line is capacitively coupled to two adjacent nodes of the four nodes of the Josephson ring modulator. The lossless on-chip flux line has an input port configured to receive a pump drive signal that couples differentially to the two adjacent nodes of the of the Josephson ring modulator. The pump drive signal thereby excites a common mode of the on-chip Josephson parametric converter.

A via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.

Provided is a divider capable of accurately evaluating an object to be measured without being affected by impedance of a terminal to be measured of the object to be measured, and a signal generation system. There is provided a divider including an input terminal, a plurality of output terminals, a distribution unit that distributes a high frequency signal input to the input terminal and outputs signals obtained by the distribution, and a plurality of reflected wave blocking units that are respectively connected to a plurality of distribution unit outputs and attenuate reflected waves reflected by sides of the plurality of output terminals. The distribution unit includes the plurality of distribution unit outputs and outputs the high frequency signal distributed from the plurality of distribution unit outputs. Outputs from the plurality of reflected wave blocking units are output from the plurality of output terminals.