Example dielectric filters, transceiver devices, and base stations are described. One example dielectric filter includes a dielectric block whose surface is covered with a metal layer, where the dielectric block includes at least two resonant cavities. The dielectric block is provided with a via hole, the via hole is located between two adjacent resonant cavities, and an inner wall of the via hole is covered with a metal layer. A first partition ring is disposed on the surface of the dielectric block and is surrounding at least one opening of the via hole, and the dielectric block is exposed in an area enclosed by an inner edge of the first partition ring and an outer edge of the first partition ring.

The disclosure provides a filtering module for a cavity filter having a housing defining an enclosed cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of planar resonators arranged within the cavity, one or more of the resonators being rotatable about an axis of rotation so as to vary an electric-field coupling between the resonator and other resonators of the plurality of resonators. The disclosure also provides a cavity filter having an input for receiving a signal to be filtered; a plurality of filtering modules, each filtering module comprising: a cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of resonators arranged within the cavity, at least one of the resonators being movable so as to vary an electromagnetic coupling between the resonator and other resonators of the plurality of resonators; and an output for outputting a filtered signal.

The disclosure provides a filtering module for a cavity filter having a housing defining an enclosed cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of planar resonators arranged within the cavity, one or more of the resonators being rotatable about an axis of rotation so as to vary an electric-field coupling between the resonator and other resonators of the plurality of resonators. The disclosure also provides a cavity filter having an input for receiving a signal to be filtered; a plurality of filtering modules, each filtering module comprising: a cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of resonators arranged within the cavity, at least one of the resonators being movable so as to vary an electromagnetic coupling between the resonator and other resonators of the plurality of resonators; and an output for outputting a filtered signal.

A method of fabricating an RF filter on a semiconductor package comprises forming a first dielectric buildup film. A second dielectric buildup film is formed over the first dielectric buildup film, the second dielectric buildup film comprising a dielectric material that contains a metallization catalyst, wherein the dielectric material comprises one of an epoxy-polymer blend dielectric material, silicon dioxide and silicon nitride, and a low-k dielectric. A trench is formed in the second dielectric buildup film with laser ablation, wherein the laser ablation selectively activates sidewalls of the trench for electroless metal deposition. A metal selectively is plated to sidewalls of the trench based at least in part on the metallization catalyst and immersion in an electroless solution. A low-loss buildup film is formed over the metal that substantially fills the trench.

A method of fabricating an RF filter on a semiconductor package comprises forming a first dielectric buildup film. A second dielectric buildup film is formed over the first dielectric buildup film, the second dielectric buildup film comprising a dielectric material that contains a metallization catalyst, wherein the dielectric material comprises one of an epoxy-polymer blend dielectric material, silicon dioxide and silicon nitride, and a low-k dielectric. A trench is formed in the second dielectric buildup film with laser ablation, wherein the laser ablation selectively activates sidewalls of the trench for electroless metal deposition. A metal selectively is plated to sidewalls of the trench based at least in part on the metallization catalyst and immersion in an electroless solution. A low-loss buildup film is formed over the metal that substantially fills the trench.

A dielectric element for a resonator and a corresponding resonator are described. The dielectric element has a first chamber and a second chamber, which are fluidically connected to one another by a connecting channel. A liquid crystal is contained in the first chamber, a gas is contained in the second chamber. Changes in the volume of the liquid crystal can be compensated by a change in the volume of the gas, because the liquid crystal can move in the connecting channel. Consequently, such a resonator can be exposed to greatly fluctuating temperature ranges without requiring any further compensation for temperature-induced changes in the volume of the liquid crystal. The dielectric element can also be hermetically closed to complete the production process.

A dielectric element for a resonator and a corresponding resonator are described. The dielectric element has a first chamber and a second chamber, which are fluidically connected to one another by a connecting channel. A liquid crystal is contained in the first chamber, a gas is contained in the second chamber. Changes in the volume of the liquid crystal can be compensated by a change in the volume of the gas, because the liquid crystal can move in the connecting channel. Consequently, such a resonator can be exposed to greatly fluctuating temperature ranges without requiring any further compensation for temperature-induced changes in the volume of the liquid crystal. The dielectric element can also be hermetically closed to complete the production process.

The disclosure discloses a concave triple-mode cavity resonance structure and a filter with the resonance structure. The structure comprises a cavity and a cover plate, wherein the cavity is internally provided with a dielectric resonance block and a dielectric support frame; at least one end face of the cavity and/or the dielectric response block is concave; the dielectric resonance block and the dielectric support frame form a triple-mode dielectric resonance rod; one end or any end of the cube-like dielectric resonance block is connected with the dielectric support frame; the dielectric support frame is connected with an inner wall of the cavity; and the dielectric response block and the dielectric support frame form triple-mode resonance in three directions along the X, Y and Z axes of the cavity.

A dielectric filter includes: a resonator body formed of dielectric material; surrounding dielectric portion present around the resonator body and formed of dielectric material having a relative permittivity lower than the dielectric material used to form the resonator body; and an input/output conductor portion formed of a conductor and configured to perform at least one supply of an electromagnetic wave to the resonator body and reception of an electromagnetic wave from the resonator body. The resonator body has a first end face and a second end face located at opposite ends in a first direction. The input/output conductor portion is located either at least part of the input/output conductor portion is contained in a space formed by shifting a virtual plane corresponding to the first end face in the first direction away from the second end face, or the input/output conductor portion is in contact with the space.

A dielectric filter includes: a resonator body formed of dielectric material; surrounding dielectric portion present around the resonator body and formed of dielectric material having a relative permittivity lower than the dielectric material used to form the resonator body; and an input/output conductor portion formed of a conductor and configured to perform at least one supply of an electromagnetic wave to the resonator body and reception of an electromagnetic wave from the resonator body. The resonator body has a first end face and a second end face located at opposite ends in a first direction. The input/output conductor portion is located either at least part of the input/output conductor portion is contained in a space formed by shifting a virtual plane corresponding to the first end face in the first direction away from the second end face, or the input/output conductor portion is in contact with the space.