A directional coupler may include a first coupled section comprising a first and a second coupled transmission lines, the first coupled transmission line having a first end coupled to an input port. The directional coupler may also include a second coupled section comprising a first and a second coupled transmission lines. The directional coupler may also include a third coupled section comprising a first and a second coupled transmission lines. The first coupled transmission line of the third coupled section has a first end coupled to a second end of the second coupled transmission line of the second coupled section and a second end coupled to an output port. The directional coupler may further include a delay section. A total electrical length of the first coupled section, the second coupled section, the third coupled section, and the delay section is about 90 degrees.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A phase-shift unit includes: a first substrate and a second substrate provided opposite to each other; a medium layer provided between the first substrate and the second substrate; a microstrip line disposed at a side of the second substrate facing towards the first substrate; and a grounding layer provided at a side of the first substrate facing towards the second substrate and formed with a via hole; wherein a projection of the via hole onto the second substrate and a projection of the microstrip line onto the second substrate have an overlapped area therebetween; and wherein the via hole is configured to feed a phase-shifted microwave signal out of the phase-shift unit, or feed a microwave signal into the phase-shift unit such that the microwave signal is phase-shifted.

Embodiments described herein perform incisions along the direction of the long axis of the waveguide, thereby exposing a trench structure which can be readily plated. Once divided and plated, the individual cut pieces can then be secured together to restore the original waveguide structure. In this fashion, multiple cut pieces can be secured together and used as building blocks to create a modular solution which can be used to provide a number of different customizable waveguide structures. Thus, embodiments described herein can perform plating procedures in a less expensive manner while achieving the benefits of ganged waveguide structures. Moreover, embodiments described herein can offer a modular approach to ganged waveguide design thereby allowing for end-user flexibility in testing.

A microwave circulator/isolator includes PINs, a shell, and a locating dielectric slice, wherein a laminated assembly is arranged in the shell, notches are formed in the peripheral wall of the shell, and the laminated assembly includes a central conductor electrically connected to the PINs which are fixed to the locating dielectric slice arranged in the shell. The microwave circulator/isolator simplifies the production process, lowers the machining difficulty of the shell, reduces the production cost, and improves the production efficiency.

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

An electronic device is provided, including: a first substrate, a plurality of phase shifters, a second substrate, a plurality of patches, a common electrode layer, a dielectric layer, and a liquid-crystal layer. The plurality of phase shifters are disposed on the first substrate. The second substrate has an inner side facing the first substrate. The plurality of patches are disposed on the inner side of the second substrate. The dielectric layer is disposed between the common electrode layer and the second substrate and on the plurality of patches. The liquid-crystal layer is disposed between the plurality of phase shifters and the common electrode layer.

Systems and methods for phasing line holders are described herein. In certain embodiments, an apparatus includes a groove in a conductive body. Additionally, the apparatus includes a phasing line for electrically coupling a plurality of components, the phasing line extending through the groove. Further, the apparatus includes a holder inserted into the groove, the holder maintaining the phasing line at a specific position in relation to a plurality of groove surfaces, wherein a plurality of holder surfaces apply sufficient pressure to the plurality of groove surfaces to secure the holder within the groove.

A system for manufacturing an antenna includes a first stamping station, a pressure sensitive adhesive (PSA) alignment station, a bonding station, a second stamping station, and a ferrite shield station. The first stamping station receives a sheet of metallic material and stamps the sheet to form an antenna including traces, contacts, a carrier connected to the traces, and a tie-bar connected between the traces. The PSA alignment station receives the stamped antenna and aligns a PSA area of a pad with the traces, the PSA area being substantially the same shape as the traces. The bonding station bonds the PSA area to the traces after it has been aligned with the traces. The second stamping station performs a second stamping of the antenna and the PSA area to remove the carrier and the tie-bar. The ferrite shield station bonds a ferrite shield to the antenna stamped for a second time.

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.