A coaxial filter comprises a housing that surrounds a receiving space. The housing comprises a trough-shaped housing element with sidewalls and a front wall. The housing further comprises a further trough-shaped housing element, wherein the two trough-shaped housing elements are placed on top of one another, thus forming the receiving space; or a lid arrangement which, together with the trough-shaped housing element forms the receiving space. At least one resonator inner conductor arrangement comprises a connecting bridge, with which resonator inner conductors are conductingly connected.

Difficulties in grounding a non-integral, deep drawn resonator (DDR) to the filter body of a cavity may be substantially eliminated by preventing the movement of the DDR away from a grounding contact area on the filter body. The addition of a compression plate and stop limiter in the connection of the non-integral DR to the filter body helps insure that any such movement is eliminated or substantially reduced.

A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.

An apparatus includes a top conductive layer of on an integrated circuit waveguide filter and a bottom conductive layer. The top and bottom conductive layers are coupled via a plurality of couplers that form an outline of the waveguide filter. A dielectric substrate layer is disposed between the top conductive layer and the bottom conductive layer of the integrated circuit waveguide filter. The dielectric substrate layer has a relative permittivity, εr that affects the tuning of the integrated circuit waveguide filter. At least one tunable via includes a tunable material disposed within the dielectric substrate layer and is coupled to a set of electrodes. The set of electrodes enable a voltage to be applied to the tunable material within the tunable via to change the relative permittivity of the dielectric substrate layer and to enable tuning the frequency characteristics of the integrated circuit waveguide filter.

The dielectric resonator includes a sealing cover, a dielectric resonant column, a metal cavity, and an electrically-conductive elastic structure body. The dielectric resonant column is located within the metal cavity, wherein the sealing cover is connected to an upper surface of the dielectric resonant column. The sealing cover is located at the upper end face of the metal cavity and is configured to seal the metal cavity. The metal cavity is provided with a groove at the bottom. The electrically-conductive elastic structure body is located within the groove and is configured to support the dielectric resonant column. The depth of the groove causes a lower surface of the dielectric resonant column to be lower than an inner bottom surface of the metal cavity after the sealing cover seals the metal cavity. A lower end face of the dielectric resonant column is in contact with the electrically-conductive elastic structure body.

A feed line to waveguide lateral transition is described consisting of: a proximity coupled antenna element on the top surface of a composite RF board, an embedded microstrip or stripline feed line, a ground plane on the bottom surface of the RF board, and a waveguide with an aperture enclosing the antenna element with a signal propagation through the waveguide being perpendicular to the antenna element.

A multi-resonator filter has a signal input terminal, a signal output terminal, and a plurality of resonator components. The plurality of resonator components include an input resonator component coupled to the signal input terminal, an output resonator component coupled to the signal output terminal, and at least one intermediate resonator component coupled between the input resonator component and the output resonator component. The input resonator component, output resonator component and the at least one intermediate resonator component are arranged in a sequence to define a signal path between the signal input terminal and the signal output terminal. The at least one intermediate resonator component includes at least one multiple resonator component, where each multiple resonator component includes a pair of individual resonators coupled in parallel where each individual resonator in a given pair of individual resonators has the same resonant frequency.

A cavity filter includes a cavity, a cover plate, a tuning component, and a resonant column. The cover plate is connected to the cavity, and the cover plate is configured to cover the cavity to form a resonant cavity. A through hole is provided on the cover plate, and the tuning component passes through the through hole and is fastened on the cover plate. The tuning part includes a high-conductivity part and a non-conductivity part, the high-conductivity part is located in the cavity, and the resonant column is in the cavity.

Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic stepped impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be, for example, tapered, sectioned, or stair-stepped in order to provide different impedances in the ceramic resonator.

A hybrid-harmonic waveguide filter includes transformer sections at end terminals of the harmonic waveguide filter, a number of corrugations along the length of the waveguide filter, and multiple ridge interconnects that couple the corrugations. By shaping the identical-cross-section ridge interconnects via single-pass wire electrical-discharge machining (EDM), low manufacturing cost is achieved along with continuous broadband rejection of TEn0 modes and an extremely high-power handling capability is observed.