A cover for a sunken enclosure includes a mounting part for mounting it to a sunken enclosure with which it is used such that the cover is movable between a closed position in which it closes an open top of the enclosure and is substantially level with a surface intersected by the open top, and an open position in which it is displaced from the surface and exposes an internal area of the enclosure, and in which the cover includes an antenna for transmitting and receiving radio waves.

A light fixture can include a housing comprising at least one wall that forms a cavity, wherein the housing complies with applicable standards for a hazardous environment. The light fixture can also include an antenna assembly disposed on an outer surface of the housing. The antenna assembly can provide communication with another device within the hazardous environment without compromising the applicable standards for the hazardous environment.

An antenna module includes a dielectric substrate, a plurality of patch antennas, an integrated circuit, a connector, a heat-radiating member, and connection members. The dielectric substrate includes a first substrate part, a second substrate part, and a third substrate part. The second substrate part is bent toward a rear surface of the first substrate part with respect to the front surface of the first substrate part and the third substrate part is bent toward the rear surface of the first substrate part with respect to the front surface of the first substrate part.

A radio system can have an antenna interface unit (AIU), a processor controller unit (PCU), and an interface cable. The AIU can be coupled to one or more antennae and can be configured to receive signals and/or convert the signals to digital signals. The PCU can be coupled to the AIU. The PCU can be configured to receive the analog signals via the interface cable, which can be configured to convey signals according to Wi-Fi, Ethernet, and RF protocols. The interface cable can be configured to provide power from the PCU to the AIU. The PCU can include a contactor controller for protecting against reverse polarity DC power connection.

Some embodiments of the present disclosure relate to an assembly. In some embodiments the assembly comprises at least one antenna and a thermal insulation component. In some embodiments, the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz. In some embodiments, the thermal insulation component is disposed within the field of RF communication. In some embodiments, the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m.Math.K to 0.025 W/m.Math.K at 25° C. and 1 atm.

A semiconductor package includes a redistribution wiring layer having redistribution wirings, a semiconductor chip on the redistribution wiring layer, a frame on the redistribution wiring layer, the frame surrounding the semiconductor chip, and the frame having core connection wirings electrically connected to the redistribution wirings, and an antenna structure on the frame, the antenna structure including a ground pattern layer, a first antenna insulation layer, a radiator pattern layer, a second antenna insulation layer, and a director pattern layer sequentially stacked on one another.

A radio-frequency (RF) heat shield for electronics includes a first and second outer skin formed of an insulating material, an insulating core layer arranged between the first and second outer skin, wherein the insulating core layer has a lower dielectric constant as compared with a higher dielectric constant of the first and second outer skin, and a frequency selective surface (FSS) layer including a reflective metallization pattern that is RF transparent and formed on an exterior surface of each of the first and second outer skin.

An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.

Aspects of the subject disclosure may include, for example, obtaining data regarding interference detected in a received communication signal, and performing polarization adjusting for one or more orthogonally-polarized element pairs of an antenna system such that an impact of the interference on the antenna system is minimized. Other embodiments are disclosed.

A wireless communication system includes a transmitter configured to transmit at least first and second radio waves having respective different frequencies F1 and F2, an electrically conductive first passive substantially linear medium, an electrically conductive first passive substantially nonlinear medium disposed proximate the first passive substantially linear medium, and a first magnetic film covering at least a portion of the first passive substantially linear medium. When the transmitter transmits the first and second radio waves, the first passive substantially linear and nonlinear media receive the first and second radio waves and generate first and second signals propagating therein at the respective frequencies F1 and F2. At least one intermodulation signal having a frequency F3 equal to nF1+mF2, where m and n positive or negative integers, is generated in the first passive substantially nonlinear medium. The first magnetic film reduces the at least one intermodulation signal by at least 2 dB.